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通过在氮化镓中掺杂铟和铝原子显著抑制热输运。

Significantly suppressed thermal transport by doping In and Al atoms in gallium nitride.

作者信息

Qi Chengdong, Yu Linfeng, Zhu Xiaolu, Li Shaoxun, Du Kun, Qin Zhenzhen, Qin Guangzhao, Xiong Zhihua

机构信息

Key Laboratory for Optoelectronics and Communication of Jiangxi Province, Jiangxi Science Technology Normal University, Nanchang 330038, China.

State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, China.

出版信息

Phys Chem Chem Phys. 2022 Sep 14;24(35):21085-21093. doi: 10.1039/d2cp02312a.

Abstract

Thermal transport plays a key role in the working stability of gallium nitride (GaN) based optoelectronic devices, where doping has been widely employed for practical applications. However, it remains unclear how doping affects thermal transport. In this study, based on first-principles calculations, we studied the doping effect on the thermal transport properties of GaN by substituting Ga with In/Al atoms. The thermal conductivities at 300 K along the in-plane(out-of-plane) directions of In- and Al-doped GaN are calculated to be 7.3(8.62) and 12.45(11.80) W m K, respectively, which are more than one order of magnitude lower compared to that of GaN [242(239) W m K]. From the analysis of phonon transport properties, we find that the low phonon group velocity and small phonon relaxation time dominate the degenerated thermal conductivity, which originated from the strong phonon anharmonicity of In/Al-doped GaN. Furthermore, by examining the crystal structure and electronic properties, the lowered thermal conductivity is revealed lying in the strong polarization of In-N and Al-N bonds, which is due to the large difference in electronegativity of In/Al and N atoms. The results achieved in this study have guiding significance to the thermal transport design of GaN-based optoelectronic devices.

摘要

热输运在基于氮化镓(GaN)的光电器件的工作稳定性中起着关键作用,其中掺杂已被广泛应用于实际应用中。然而,目前尚不清楚掺杂如何影响热输运。在本研究中,基于第一性原理计算,我们通过用In/Al原子替代Ga来研究掺杂对GaN热输运性质的影响。计算得出,In掺杂和Al掺杂的GaN在300 K时沿面内(面外)方向的热导率分别为7.3(8.62)和12.45(11.80)W m⁻¹ K⁻¹,与GaN的热导率[242(239)W m⁻¹ K⁻¹]相比降低了一个多数量级。通过对声子输运性质的分析,我们发现低声子群速度和小声子弛豫时间主导了退化的热导率,这源于In/Al掺杂GaN的强声子非谐性。此外,通过研究晶体结构和电子性质,发现热导率降低在于In-N和Al-N键的强极化,这是由于In/Al和N原子的电负性差异较大。本研究取得的结果对基于GaN的光电器件的热输运设计具有指导意义。

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