Rogers O W
Aust Dent J. 1979 Feb;24(1):13-6. doi: 10.1111/j.1834-7819.1979.tb03590.x.
A technique has been developed and described for the examination of the interface between dissimilar metals, utilizing electrolytic etching and gold electro-deposition procedures. This procedure permitted etching of both the constituents of the silver solder-stainless steel interface without differential leveling. The grain boundaries at the surface of the stainless steel interface were accentuated by the chemical action of the flux during the joining procedure and the notched grain boundaries influenced the nucleation of the silver solder. No evidence of alloying was found within the resolution of the instruments used.
已经开发并描述了一种利用电解蚀刻和金电沉积程序来检查异种金属界面的技术。该程序允许对银焊料 - 不锈钢界面的两种成分进行蚀刻，而不会出现差异平整。在连接过程中，助熔剂的化学作用使不锈钢界面表面的晶界更加明显，有缺口的晶界影响了银焊料的形核。在所使用仪器的分辨率范围内，未发现合金化的迹象。
