Tian Wenchao, Li Bin, Li Zhao, Cui Hao, Shi Jing, Wang Yongkun, Zhao Jingrong
School of Electro-Mechnical Engineering, Xidian University, Xi'an 710000, China.
Shanghai Sharetek Technology Co., Ltd., Shanghai 200000, China.
Micromachines (Basel). 2022 Oct 20;13(10):1790. doi: 10.3390/mi13101790.
With the rapid development of 5G, artificial intelligence (AI), and high-performance computing (HPC), there is a huge increase in the data exchanged between the processor and memory. However, the "storage wall" caused by the von Neumann architecture severely limits the computational performance of the system. To efficiently process such large amounts of data and break up the "storage wall", it is necessary to develop processing-in-memory (PIM) technology. Chiplet combines processor cores and memory chips with advanced packaging technologies, such as 2.5D, 3 dimensions (3D), and fan-out packaging. This improves the quality and bandwidth of signal transmission and alleviates the "storage wall" problem. This paper reviews the Chiplet packaging technology that has achieved the function of PIM in recent years and analyzes some of its application results. First, the research status and development direction of PIM are presented and summarized. Second, the Chiplet packaging technologies that can realize the function of PIM are introduced, which are divided into 2.5D, 3D packaging, and fan-out packaging according to their physical form. Further, the form and characteristics of their implementation of PIM are summarized. Finally, this paper is concluded, and the future development of Chiplet in the field of PIM is discussed.
随着5G、人工智能（AI）和高性能计算（HPC）的快速发展，处理器与内存之间交换的数据量大幅增加。然而，冯·诺依曼架构导致的“存储墙”严重限制了系统的计算性能。为了高效处理如此大量的数据并突破“存储墙”，有必要开发内存处理（PIM）技术。小芯片通过2.5D、三维（3D）和扇出封装等先进封装技术将处理器核心与内存芯片结合在一起。这提高了信号传输的质量和带宽，缓解了“存储墙”问题。本文综述了近年来实现PIM功能的小芯片封装技术，并分析了其一些应用成果。首先，对PIM的研究现状和发展方向进行了介绍和总结。其次，介绍了能够实现PIM功能的小芯片封装技术，根据其物理形式分为2.5D、3D封装和扇出封装。进一步总结了它们实现PIM的形式和特点。最后，对本文进行总结，并探讨了小芯片在PIM领域的未来发展。
