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通过能带工程和内外延纳米结构提高In掺杂和AgCuTe合金化SnTe的热电性能。

Enhanced thermoelectric performance of In-doped and AgCuTe-alloyed SnTe through band engineering and endotaxial nanostructures.

作者信息

Peng Panpan, Wang Chao, Li Lanwei, Li Shuyao, Chen Jing, Fan Pengya, Du Rui, Si Haotian, Cheng Zhenxiang, Wang Jianli

机构信息

Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng, 475004, China.

Department of Technology and Physics, Zhengzhou University of Light Industry, Zhengzhou, 450002, China.

出版信息

Phys Chem Chem Phys. 2022 Nov 18;24(44):27105-27113. doi: 10.1039/d2cp03477h.

Abstract

Endotaxial nanostructures can reduce lattice thermal conductivity through enhancing phonon scattering without affecting electrical transport, leading to a high thermoelectric performance. On the other hand, band engineering can enhance electrical transport by improving the Seebeck coefficient through valence band convergence and the resonance level. In this paper, the synergistic effect of band engineering and endotaxial nanostructures was implemented in SnTe thermoelectric materials by alloying with AgCuTe and doping with Indium. The positron annihilation lifetime spectra show that the vacancy concentration in SnTe was reduced after alloying with AgCuTe, which led to a decreasing hole concentration and improved carrier mobility. Additionally, the diffusion of Ag in the matrix during the preparation can facilitate valence band convergence. Therefore, the power factor of SnTe is greatly increased to 18 μW cm K at 800 K, which can be further increased to 21.4 μW cm K at 800 K after In doping due to resonance level formation. Meanwhile, CuTe endotaxial nanostructures also can be observed in the TEM image after SnTe alloying with AgCuTe. So, the lattice thermal conductivity significantly reduced to 0.93 W m K in In-doped and AgCuTe-alloyed SnTe. Finally, we obtain an enhanced value of 1.14 in SnInTe-1%AgCuTe at 800 K.

摘要

外延纳米结构可以通过增强声子散射来降低晶格热导率,而不影响电传输,从而实现高热电性能。另一方面,能带工程可以通过价带收敛和共振能级提高塞贝克系数来增强电传输。在本文中,通过与AgCuTe合金化和铟掺杂,在SnTe热电材料中实现了能带工程和外延纳米结构的协同效应。正电子湮没寿命谱表明,与AgCuTe合金化后,SnTe中的空位浓度降低,导致空穴浓度降低,载流子迁移率提高。此外,制备过程中Ag在基体中的扩散有助于价带收敛。因此,SnTe的功率因子在800 K时大幅提高到18 μW cm K,由于形成共振能级,铟掺杂后在800 K时可进一步提高到21.4 μW cm K。同时,在SnTe与AgCuTe合金化后的透射电镜图像中也可以观察到CuTe外延纳米结构。因此,在铟掺杂和AgCuTe合金化的SnTe中,晶格热导率显著降低至0.93 W m K。最后,我们在800 K时的SnInTe-1%AgCuTe中获得了1.14的增强值。

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