用于玻璃纤维增强塑料单搭接接头的电磁加热可分离式FeO纳米颗粒掺杂环氧树脂胶粘剂

FeO-Nanoparticle-Doped Epoxy Resin as a Detachable Adhesive by Electromagnetic Heating for GFRP Single-Lap Joints.

作者信息

Sánchez-Romate Xoan F, Del Bosque Antonio, Crespo Anabel, Alonso Rafael, Sánchez María, Ureña Alejandro

机构信息

Materials Science and Engineering Area, Escuela Superior de Ciencias Experimentales y Tecnología, Universidad Rey Juan Carlos, Calle Tulipán s/n, 28933 Móstoles, Spain.

AIMPLAS Instituto Tecnológico del Plástico, Carrer de Gustave Eiffel 4, 46980 Paterna, Spain.

出版信息

Nanomaterials (Basel). 2022 Nov 6;12(21):3913. doi: 10.3390/nano12213913.

DOI:10.3390/nano12213913

PMID:36364689

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC9658479/

Abstract

An adhesive based on a FeO-nanoparticle (MNP)-doped epoxy resin was proposed for the development of detachable adhesive joints with GFRP substrates. The analysis of cryofractures showed that the increasing MNP content promotes a higher presence of larger aggregates and a lower sedimentation of nanoparticles due to the higher viscosity of the mixture. In this regard, the inclusion of expandable microspheres (MS) induces a more uniform dispersion of MNPs, reducing their sedimentation. The capability of the proposed adhesives for electromagnetic (EM) heating was also evaluated, with increases in temperature of around 100 °C at 750 A, enough to reach the T of the polymer required to facilitate the adhesive detachment, which is around 80 °C. Finally, the lap shear strength (LSS) of 14 and 20 wt.% MNP samples was evaluated in a single-lap shear joint with simultaneous EM heating. The LSS values were reduced by 60-80% at 750 A, thus promoting successful adhesive joint detachment under EM heating.

摘要

提出了一种基于掺有FeO纳米颗粒（MNP）的环氧树脂的胶粘剂，用于开发与玻璃纤维增强塑料（GFRP）基材的可拆卸粘结接头。低温断裂分析表明，由于混合物粘度较高，MNP含量增加会促使更大聚集体的存在增加，且纳米颗粒的沉降减少。在这方面，加入可膨胀微球（MS）可使MNPs分散更均匀，减少其沉降。还评估了所提出的胶粘剂的电磁（EM）加热能力，在750 A电流下温度升高约100°C，足以达到促进胶粘剂分离所需的聚合物温度，约为80°C。最后，在同时进行EM加热的单搭接剪切接头中评估了14 wt.%和20 wt.% MNP样品的搭接剪切强度（LSS）。在750 A电流下，LSS值降低了60 - 80%，从而促进了在EM加热下粘结接头的成功分离。