Yue Jian, Cui Anqi, Wang Fei, Han Lei, Dai Jinguo, Sun Xiangyi, Lin Hang, Wang Chunxue, Chen Changming, Zhang Daming
State Key Laboratory of Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, China.
China Xi'an Satellite Control Center, Xi'an 710000, China.
Micromachines (Basel). 2022 Nov 30;13(12):2117. doi: 10.3390/mi13122117.
In this work, heterogeneous integration of both two-dimensional (2D) optical phased arrays (OPAs) and on-chip laser arrays based on a silicon photonic platform is proposed. The tunable multi-quantum-well (MQW) laser arrays, active switching/shifting arrays, and grating antenna arrays are used in the OPA module to realize 2D spatial beam scanning. The 2D OPA chip is composed of four main parts: (1) tunable MQW laser array emitting light signals in the range of 1480-1600 nm wavelengths; (2) electro-optic (EO) switch array for selecting the desired signal light from the on-chip laser array; (3) EO phase-shifter array for holding a fixed phase difference for the uniform amplitude of specific optical signal; and (4) Bragg waveguide grating antenna array for controlling beamforming. By optimizing the overall performances of the 2D OPA chip, a large steering range of 88.4° × 18° is realized by tuning both the phase and the wavelength for each antenna. In contrast to the traditional thermo-optic LIDAR chip with an external light source, the overall footprint of the 2D OPA chip can be limited to 8 mm × 3 mm, and the modulation rate can be 2.5 ps. The ultra-compact 2D OPA assembling with on-chip tunable laser arrays using hybrid integration could result in the application of a high-density, high-speed, and high-precision lidar system in the future.
在这项工作中,提出了基于硅光子平台的二维(2D)光学相控阵(OPA)和片上激光阵列的异质集成。OPA模块中使用了可调谐多量子阱(MQW)激光阵列、有源开关/移位阵列和光栅天线阵列,以实现二维空间光束扫描。二维OPA芯片由四个主要部分组成:(1)可调谐MQW激光阵列,发射波长在1480 - 1600 nm范围内的光信号;(2)电光(EO)开关阵列,用于从片上激光阵列中选择所需的信号光;(3)EO移相器阵列,用于为特定光信号的均匀幅度保持固定的相位差;(4)布拉格波导光栅天线阵列,用于控制波束形成。通过优化二维OPA芯片的整体性能,通过对每个天线的相位和波长进行调谐,实现了88.4°×18°的大转向范围。与具有外部光源的传统热光激光雷达芯片相比,二维OPA芯片的整体尺寸可限制在8 mm×3 mm,调制速率可达2.5 ps。采用混合集成方式将超紧凑的二维OPA与片上可调谐激光阵列组装在一起,未来可能会应用于高密度、高速和高精度的激光雷达系统。