Guo Zongfu, Luo Xichun, Hu Xiaoping, Jin Tan
School of Mechanical Engineering, Hangzhou Dianzi University, Hangzhou 310018, China.
Centre for Precision Manufacturing, DMEM, University of Strathclyde, Glasgow G1 1XJ, UK.
Micromachines (Basel). 2022 Dec 10;13(12):2188. doi: 10.3390/mi13122188.
A non-contact ultrasonic abrasive machining approach provides a potential solution to overcome the challenges of machining efficiency in the high-precision polishing of optical components. Accurately modeling the material removal distribution (removal function (RF)) and surface morphology is very important in establishing this new computer-controlled deterministic polishing technique. However, it is a challenging task due to the absence of an in-depth understanding of the evolution mechanism of the material removal distribution and the knowledge of the evolution law of the microscopic surface morphology under the complex action of ultrasonic polishing while submerged in liquid. In this study, the formation of the RF and the surface morphology were modeled by investigating the cavitation density distribution and conducting experiments. The research results showed that the material removal caused by cavitation bubble explosions was uniformly distributed across the entire working surface and had a 0.25 mm edge influence range. The flow scour removal was mainly concentrated in the high-velocity flow zone around the machining area. The roughness of the machined surface increased linearly with an increase in the amplitude and gap. Increasing the particle concentration significantly improved the material removal rate, and the generated surface exhibited better removal uniformity and lower surface roughness.
非接触式超声研磨加工方法为克服光学元件高精度抛光中加工效率的挑战提供了一种潜在的解决方案。准确地对材料去除分布(去除函数(RF))和表面形貌进行建模对于建立这种新的计算机控制确定性抛光技术非常重要。然而,由于缺乏对材料去除分布演变机制的深入理解,以及在液体中浸没的超声抛光复杂作用下微观表面形貌演变规律的认识,这是一项具有挑战性的任务。在本研究中,通过研究空化密度分布并进行实验,对RF的形成和表面形貌进行了建模。研究结果表明,空化气泡爆炸引起的材料去除在整个工作表面上均匀分布,边缘影响范围为0.25mm。流动冲刷去除主要集中在加工区域周围的高速流动区。加工表面的粗糙度随振幅和间隙的增加而线性增加。增加颗粒浓度显著提高了材料去除率,并且生成的表面表现出更好的去除均匀性和更低的表面粗糙度。