Ji Meilin, Yang Haolin, Zhou Yongxin, Xiu Xueying, Lv Haochen, Zhang Songsong
School of Microelectronics, Shanghai University, Shanghai 200444, China.
Shanghai Industrial µTechnology Research Institute, Shanghai 201800, China.
Micromachines (Basel). 2022 Dec 19;13(12):2260. doi: 10.3390/mi13122260.
This paper presents a novel bimorph Piezoelectric Micromachined Ultrasonic Transducer (PMUT) fabricated with 8-inch standard CMOS-compatible processes. The bimorph structure consists of two layers of 20% scandium-doped aluminum nitride (ScAlN) thin films, which are sandwiched among three molybdenum (Mo) layers. All three Mo layers are segmented to form the outer ring and inner plate electrodes. Both top and bottom electrodes on the outer ring are electrically linked to the center inner plate electrodes. Likewise, the top and bottom center plate electrodes are electrically connected to the outer ring in the same fashion. This electrical configuration maximizes the effective area of the given PMUT design and improves efficiency during the electromechanical coupling process. In addition, the proposed bimorph structure further simplifies the device's electrical layout with only two-terminal connections as reported in many conventional unimorph PMUTs. The mechanical and acoustic measurements are conducted to verify the device's performance improvement. The dynamic mechanical displacement and acoustic output under a low driving voltage (1 Vpp) are more than twice that reported from conventional unimorph devices with a similar resonant frequency. Moreover, the pulse-echo experiments indicate an improved receiving voltage of 10 mV in comparison with the unimorph counterpart (4.8 mV). The validation of device advancement in the electromechanical coupling effect by using highly doped ScAlN thin film, the realization of the proposed bimorph PMUT on an 8-inch wafer paves the path to production of next generation, high-performance piezoelectric MEMS.
本文介绍了一种采用8英寸标准CMOS兼容工艺制造的新型双压电晶片压电微机械超声换能器(PMUT)。双压电晶片结构由两层20%钪掺杂氮化铝(ScAlN)薄膜组成,这两层薄膜夹在三层钼(Mo)层之间。所有三层钼层均被分割以形成外环和内板电极。外环上的顶部和底部电极均与中心内板电极电连接。同样,顶部和底部中心板电极也以相同方式与外环电连接。这种电气配置使给定PMUT设计的有效面积最大化,并提高了机电耦合过程中的效率。此外,所提出的双压电晶片结构进一步简化了器件的电气布局,与许多传统单压电晶片PMUT一样,仅具有双端连接。进行了机械和声学测量以验证器件性能的提升。在低驱动电压(1 Vpp)下的动态机械位移和声输出比具有相似谐振频率的传统单压电晶片器件所报告的值高出两倍以上。此外,脉冲回波实验表明,与单压电晶片对应物(4.8 mV)相比接收电压提高到了10 mV。通过使用高掺杂ScAlN薄膜验证了器件在机电耦合效应方面的进步,在8英寸晶圆上实现所提出的双压电晶片PMUT为下一代高性能压电MEMS的生产铺平了道路。