Chen Huiji, Luo Binbin, Wu Decao, Yang Xiangwen, Shi Shenghui, Zou Xue, Li Yujie, Jiang Shanghai, Zhao Mingfu
Appl Opt. 2022 Dec 20;61(36):10727-10734. doi: 10.1364/AO.478831.
This study proposes a refractive index (RI) sensor using a cascaded tapered thin-core microfiber (TTCMF) based on the Vernier effect. The thin-core fiber was made into a TTCMF by arc discharging and flame heating and then sandwiched between two single-mode fibers (SMFs). The two structures with the same SMF-TTCMF-SMF but slightly different free spectral ranges (FSRs) were cascaded to generate the Vernier effect. The FSR varied with the taper parameters of TTCMF. The RI sensitivities of a single TTCMF sensor, series SMF-TTCMF-SMF sensor, and parallel SMF-TTCMF-SMF sensor were compared and analyzed. Using the Vernier effect in the RI measurement range from 1.3313 to 1.3392, a very high RI sensitivity of -15,053.411 / was obtained using the series SMF-TTCMF-SMF structure, and -16,723.243 / using the parallel structure, which were basically consistent with the simulation results. Compared with the RI sensitivity of the single TTCMF sensor, the RI sensitivities of series and parallel sensors were increased by 4.65 times and 5.16 times, respectively. In addition, in the temperature range from 35°C to 65°C, temperature sensitivities of -0.196 / and -0.0489 / were obtained using series and parallel structures, respectively; the corresponding temperature cross errors were 1.302×10 / and 2.92×10 / , respectively. Based on the advantages of high RI sensitivity, simple structure, low-temperature cross sensitivity, and convenient fabrication, the proposed sensors have great potential in biosensing fields.
本研究提出了一种基于游标效应的级联锥形细芯微光纤(TTCMF)折射率(RI)传感器。通过电弧放电和火焰加热将细芯光纤制成TTCMF,然后夹在两根单模光纤(SMF)之间。将具有相同SMF-TTCMF-SMF但自由光谱范围(FSR)略有不同的两种结构级联以产生游标效应。FSR随TTCMF的锥形参数而变化。对单个TTCMF传感器、串联SMF-TTCMF-SMF传感器和并联SMF-TTCMF-SMF传感器的RI灵敏度进行了比较和分析。在1.3313至1.3392的RI测量范围内利用游标效应,串联SMF-TTCMF-SMF结构获得了-15,053.411 / 的非常高的RI灵敏度,并联结构获得了-16,723.243 / ,这与模拟结果基本一致。与单个TTCMF传感器的RI灵敏度相比,串联和并联传感器的RI灵敏度分别提高了4.65倍和5.16倍。此外,在35°C至65°C的温度范围内,串联和并联结构分别获得了-0.196 / 和-