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杂质掺杂导致 BiSe 的半导体-金属转变。

Semiconductor-metal transition in BiSe caused by impurity doping.

机构信息

Research Institute for Interdisciplinary Science, Okayama University, Okayama, 700-8530, Japan.

Advanced Science Research Center, Okayama University, Okayama, 700-8530, Japan.

出版信息

Sci Rep. 2023 Jan 11;13(1):537. doi: 10.1038/s41598-023-27701-5.

Abstract

Doping a typical topological insulator, BiSe, with Ag impurity causes a semiconductor-metal (S-M) transition at 35 K. To deepen the understanding of this phenomenon, structural and transport properties of Ag-doped BiSe were studied. Single-crystal X-ray diffraction (SC-XRD) showed no structural transitions but slight shrinkage of the lattice, indicating no structural origin of the transition. To better understand electronic properties of Ag-doped BiSe, extended analyses of Hall effect and electric-field effect were carried out. Hall effect measurements revealed that the reduction of resistance was accompanied by increases in not only carrier density but carrier mobility. The field-effect mobility is different for positive and negative gate voltages, indicating that the E is located at around the bottom of the bulk conduction band (BCB) and that the carrier mobility in the bulk is larger than that at the bottom surface at all temperatures. The pinning of the E at the BCB is found to be a key issue to induce the S-M transition, because the transition can be caused by depinning of the E or the crossover between the bulk and the top surface transport.

摘要

在典型的拓扑绝缘体 BiSe 中掺杂 Ag 杂质会导致在 35K 时发生半导体-金属(S-M)转变。为了更深入地了解这一现象,研究了掺 Ag 的 BiSe 的结构和输运性质。单晶 X 射线衍射(SC-XRD)显示没有结构转变,只是晶格略有收缩,表明转变没有结构起源。为了更好地理解掺 Ag 的 BiSe 的电子性质,对 Hall 效应和电场效应进行了扩展分析。Hall 效应测量表明,电阻的降低伴随着载流子密度和载流子迁移率的增加。正、负栅极电压下的场效应迁移率不同,表明 E 位于体导带(BCB)底部附近,在所有温度下,体中的载流子迁移率都大于底部表面的载流子迁移率。发现 E 在 BCB 处的钉扎是诱导 S-M 转变的关键问题,因为转变可以通过 E 的去钉扎或体和顶部表面输运之间的交叉来引起。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f118/9834400/93d459aa8f1b/41598_2023_27701_Fig1_HTML.jpg

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