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开发一种新型流延多浆料3D打印技术以制造陶瓷/金属部件。

Development of a Novel Tape-Casting Multi-Slurry 3D Printing Technology to Fabricate the Ceramic/Metal Part.

作者信息

Jiang Cho-Pei, Romario Yulius Shan, Toyserkani Ehsan

机构信息

Department of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, Taiwan.

Graduate Institute of Manufacturing Technology, National Taipei University of Technology, Taipei 10608, Taiwan.

出版信息

Materials (Basel). 2023 Jan 6;16(2):585. doi: 10.3390/ma16020585.

Abstract

Printing ceramic/metal parts increases the number of applications in additive manufacturing technology, but printing different materials on the same object with different mechanical properties will increase the difficulty of printing. Multi-material additive manufacturing technology is a solution. This study develops a novel tape-casting 3D printing technology that uses bottom-up photopolymerization to fabricate the green body for low-temperature co-fired ceramics (LTCC) that consist of ceramic and copper. The composition of ceramic and copper slurries is optimized to allow printing without delamination and sintering without cracks. Unlike traditional tape-casting processing, the proposed method deposits two slurries on demand on a transparent film, scrapes it flat, then photopolymerization is induced using a liquid crystal displayer to project the layer pattern beneath the film. The experimental results show that both slurries have good bonding strength, with a weight ratio of powder to resin of 70:30, and print a U-shaped copper volume as a circuit within the LTCC green body. A three-stage sintering parameter is derived using thermogravimetric analysis to ensure good mechanical properties for the sintered part. The SEM images show that the ceramic/copper interface of the LTCC sintered part is well-bonded. The average hardness and flexural strength of the sintered ceramic are 537.1 HV and 126.61 MPa, respectively. Volume shrinkage for the LTCC slurry is 67.97%, which is comparable to the value for a copper slurry of 68.85%. The electrical resistance of the printed copper circuit is 0.175 Ω, which is slightly greater than the theoretical value, hence it has good electrical conductivity. The proposed tape-casting 3D printer is used to print an LTCC benchmark. The sintered benchmark part is validated for the application in the LTCC application.

摘要

打印陶瓷/金属部件增加了增材制造技术的应用数量,但在同一物体上打印具有不同机械性能的不同材料会增加打印难度。多材料增材制造技术是一种解决方案。本研究开发了一种新型的流延3D打印技术,该技术利用自下而上的光聚合作用来制造由陶瓷和铜组成的低温共烧陶瓷(LTCC)的生坯。对陶瓷和铜浆料的成分进行了优化,以实现无分层打印和无裂纹烧结。与传统的流延工艺不同,该方法按需在透明薄膜上沉积两种浆料,刮平后,使用液晶显示器在薄膜下方投射层图案以引发光聚合。实验结果表明,两种浆料均具有良好的粘结强度,粉末与树脂的重量比为70:30,并在LTCC生坯内打印出一个U形铜块作为电路。利用热重分析得出了三阶段烧结参数,以确保烧结部件具有良好的机械性能。扫描电子显微镜图像显示,LTCC烧结部件的陶瓷/铜界面结合良好。烧结陶瓷的平均硬度和抗弯强度分别为537.1 HV和126.61 MPa。LTCC浆料的体积收缩率为67.97%,与铜浆料68.85%的值相当。打印铜电路的电阻为0.175Ω,略大于理论值,因此具有良好的导电性。所提出的流延3D打印机用于打印LTCC基准件。对烧结后的基准件在LTCC应用中的适用性进行了验证。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f9b7/9863945/d5b1e25e526a/materials-16-00585-g001.jpg

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