Zheng Hang, Zhang Ruixiang, Xu Qin, Kong Xiangqing, Sun Wanting, Fu Ying, Wu Muhong, Liu Kaihui
Songshan Lake Material Laboratory, Dongguan 523808, China.
College of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 450001, China.
Materials (Basel). 2023 Jan 9;16(2):622. doi: 10.3390/ma16020622.
Metal laminated composites are widely used in industrial and commercial applications due to their excellent overall performance. In this study, the copper/graphene-aluminum-copper/graphene (Cu/Gr-Al-Cu/Gr) laminated composites were prepared by ingenious hot pressing design. Raman, optical microscope (OM), scanning electron microscope (SEM), van der Pauw (vdP), and X-Ray Diffractometer (XRD) were used to investigate the graphene status, interface bonding, diffusion layer thickness, electrical conductivity, Miller indices and secondary phases, respectively. The results demonstrate that the Cu-Al interfaces in the Cu/Gr-Al-Cu/Gr composites were free of pores, cracks and other defects and bonded well. The number of graphene layers was varied by regulating the thickness of the Cu/Gr layer, with the Cu/Gr foils fabricated by chemical vapor deposition (CVD). The electrical conductivity of the composite was significantly improved by the induced high-quality interfaces Cu/Gr structure. The increased number of graphene layers is beneficial for enhancing the electrical conductivity of the Cu/Gr-Al-Cu/Gr composite, and the highest conductivity improved by 20.5% compared to that of raw Al.
金属层状复合材料因其优异的综合性能而广泛应用于工业和商业领域。在本研究中，通过巧妙的热压设计制备了铜/石墨烯 - 铝 - 铜/石墨烯（Cu/Gr - Al - Cu/Gr）层状复合材料。分别使用拉曼光谱仪、光学显微镜（OM）、扫描电子显微镜（SEM）、范德堡（vdP）法和X射线衍射仪（XRD）来研究石墨烯状态、界面结合、扩散层厚度、电导率、密勒指数和次生相。结果表明，Cu/Gr - Al - Cu/Gr复合材料中的Cu - Al界面无孔隙、裂纹等缺陷，结合良好。通过调节Cu/Gr层的厚度来改变石墨烯层数，其中Cu/Gr箔通过化学气相沉积（CVD）制备。诱导的高质量Cu/Gr结构显著提高了复合材料的电导率。石墨烯层数的增加有利于提高Cu/Gr - Al - Cu/Gr复合材料的电导率，与原始铝相比，最高电导率提高了20.5%。
