Beh Chong You, Cheng Ee Meng, Tan Xiao Jian, Mohd Nasir Nashrul Fazli, Abdul Majid Mohd Shukry, Mohd Jamir Mohd Ridzuan, Khor Shing Fhan, Lee Kim Yee, Mohamad Che Wan Sharifah Robiah
Department of Engineering and Built Environment, Tunku Abdul Rahman University of Management and Technology, Penang Branch, Pulau Pinang 11200, Malaysia.
Faculty of Electronic Engineering & Technology, Universiti Malaysia Perlis (UniMAP), Kangar 02600, Malaysia.
Polymers (Basel). 2023 Jan 8;15(2):320. doi: 10.3390/polym15020320.
This study aims to investigate the electric responses (complex modulus and complex impedance analysis) of hydroxyapatite/starch bone scaffold as a function of hydroxyapatite/starch proportion and the microstructural features. Hence, the non-porous and porous hydroxyapatite/starch composites were fabricated with various hydroxyapatite/starch proportions (70/30, 60/40, 50/50, 40/60, 30/70, 20/80, and 10/90 wt/wt%). Microstructural analysis of the porous hydroxyapatite/starch composites was carried out by using scanning electron microscopy. It shows that the formation of hierarchical porous microstructures with high porosity is more significant at a high starch proportion. The complex modulus and complex impedance analysis were conducted to investigate the electrical conduction mechanism of the hydroxyapatite/starch composites via dielectric spectroscopy within a frequency range from 5 MHz to 12 GHz. The electrical responses of the hydroxyapatite/starch composites are highly dependent on the frequency, material proportion, and microstructures. High starch proportion and highly porous hierarchical microstructures enhance the electrical responses of the hydroxyapatite/starch composite. The material proportion and microstructure features of the hydroxyapatite/starch composites can be indirectly reflected by the simulated electrical parameters of the equivalent electrical circuit models.
本研究旨在研究羟基磷灰石/淀粉骨支架的电响应（复模量和复阻抗分析）与羟基磷灰石/淀粉比例及微观结构特征之间的关系。因此，制备了具有不同羟基磷灰石/淀粉比例（70/30、60/40、50/50、40/60、30/70、20/80和10/90 wt/wt%）的无孔和多孔羟基磷灰石/淀粉复合材料。采用扫描电子显微镜对多孔羟基磷灰石/淀粉复合材料进行微观结构分析。结果表明，在高淀粉比例下，具有高孔隙率的分级多孔微结构的形成更为显著。通过介电谱在5 MHz至12 GHz频率范围内对羟基磷灰石/淀粉复合材料的复模量和复阻抗进行分析，以研究其导电机理。羟基磷灰石/淀粉复合材料的电响应高度依赖于频率、材料比例和微观结构。高淀粉比例和高度多孔的分级微结构增强了羟基磷灰石/淀粉复合材料的电响应。等效电路模型的模拟电参数可以间接反映羟基磷灰石/淀粉复合材料的材料比例和微观结构特征。
