Hu Hong, Guo Xuyun, Zhang Yaokang, Chen Zijian, Wang Lei, Gao Yuan, Wang Ziran, Zhang Yuqi, Wang Wenshuo, Rong Mingming, Liu Guoqiang, Huang Qiyao, Zhu Ye, Zheng Zijian
Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China.
Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China.
ACS Nano. 2023 Feb 28;17(4):3921-3930. doi: 10.1021/acsnano.2c12269. Epub 2023 Feb 10.
The ability to tolerate large strains during various degrees of deformation is a core issue in the development of flexible electronics. Commonly used strategies nowadays to enhance the strain tolerance of thin film devices focus on the optimization of the device architecture and the increase of bonding at the materials interface. In this paper, we propose a strategy, namely elasto-plastic design of an ultrathin interlayer, to boost the strain tolerance of flexible electronics. We demonstrate that insertion of an ultrathin, stiff (high Young's modulus) and elastic (high yield strain) interlayer between an upper rigid film/device and a soft substrate, regardless of the substrate thickness or the interfacial bonding, can significantly reduce the actual strain applied on the film/device when the substrate is bent. Being independent of existing strategies, the elasto-plastic design strategy offers an effective method to enhance the device flexibility without redesigning the device structure or altering the material interface.
在各种程度的变形过程中耐受大应变的能力是柔性电子学发展中的一个核心问题。目前常用的提高薄膜器件应变耐受性的策略集中在器件结构的优化和材料界面处结合力的增强上。在本文中，我们提出了一种策略，即超薄中间层的弹塑性设计，以提高柔性电子学的应变耐受性。我们证明，在上部刚性薄膜/器件和软质衬底之间插入一个超薄、坚硬（高杨氏模量）且具有弹性（高屈服应变）的中间层，无论衬底厚度或界面结合情况如何，当衬底弯曲时，都能显著降低施加在薄膜/器件上的实际应变。这种弹塑性设计策略独立于现有策略，提供了一种无需重新设计器件结构或改变材料界面就能提高器件柔韧性的有效方法。
