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石墨烯/铜复合材料中的缺陷对态密度的影响。

Effect of Defects in Graphene/Cu Composites on the Density of States.

作者信息

Kim Song Mi, Park Woo Rim, Park Jun Seok, Song Sang Min, Kwon Oh Heon

机构信息

Department of Safety Engineering, Graduate School, Pukyong National University, Busan 48513, Republic of Korea.

Korea Industrial Safety Association, Seoul 08289, Republic of Korea.

出版信息

Materials (Basel). 2023 Jan 20;16(3):962. doi: 10.3390/ma16030962.

Abstract

The process of handling and bonding copper (Cu) and graphene inevitably creates defects. To use graphene/Cu composites as electronic devices with new physical properties, it is essential to evaluate the effect of such defects. Since graphene is an ultrathin anisotropic material having a hexagonal structure, an evaluation of graphene/Cu composites containing defects was conducted taking into account the inherent structural characteristics. The purpose of this study is to evaluate defects that may occur in the manufacturing process and to present a usable basic method for the stable design research and development of copper/graphene composites essential for commercialization of copper/graphene composites. In the future, when performing analytical calculations on various copper/graphene composites and defect shapes in addition to the defect conditions presented in this paper, it is considered that it can be used as a useful method considering defects that occur during application to products of desired thickness and size. Herein, density functional theory was used to evaluate the behavior of graphene/Cu composites containing defects. The density of states (DOS) values were also calculated. The analysis was implemented using three kinds of models comprising defect-free graphene and two- and four-layered graphene/Cu composites containing defects. DOS and Fermi energy levels were used to gage the effect of defects on electrical properties.

摘要

处理和结合铜(Cu)与石墨烯的过程不可避免地会产生缺陷。为了将石墨烯/Cu复合材料用作具有新物理特性的电子器件,评估此类缺陷的影响至关重要。由于石墨烯是具有六边形结构的超薄各向异性材料,因此在考虑其固有结构特征的情况下,对含有缺陷的石墨烯/Cu复合材料进行了评估。本研究的目的是评估制造过程中可能出现的缺陷,并为铜/石墨烯复合材料商业化所必需的铜/石墨烯复合材料的稳定设计研发提供一种可用的基本方法。未来,除了本文提出的缺陷条件外,当对各种铜/石墨烯复合材料和缺陷形状进行分析计算时,可以认为它是一种考虑在应用于所需厚度和尺寸的产品过程中出现的缺陷的有用方法。在此,使用密度泛函理论来评估含有缺陷的石墨烯/Cu复合材料的行为。还计算了态密度(DOS)值。分析是使用三种模型进行的,包括无缺陷石墨烯以及含有缺陷的两层和四层石墨烯/Cu复合材料。DOS和费米能级用于衡量缺陷对电学性能的影响。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/98f5/9917802/7355de3d9f91/materials-16-00962-g001.jpg

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