Luo Fengfeng, Luo Hongtai, Liu Qiuxiang, Zhou Liang, Lin Wenbin, Xie Ziyang, Guo Liping
Software Engineering Institute of Guangzhou, Guangzhou 510990, China.
Key Laboratory of Artificial Micro- and Nano-Structures of Ministry of Education, Hubei Nuclear Solid Physics Key Laboratory, School of Physics and Technology, Wuhan University, Wuhan 430072, China.
Nanomaterials (Basel). 2023 Jan 26;13(3):497. doi: 10.3390/nano13030497.
An amount of 100 dpa Si irradiation was used to study the effect of transmutation rhenium content on irradiated microscopic defects and hardening in W-xRe (x = 0, 1, 3, 5 and 10 wt.%) alloys at 550 °C. The increase in Re content could significantly refine the grain in the W-xRe alloys, and no obvious surface topography change could be found after high-dose irradiation via the scanning electron microscope (SEM). The micro defects induced by high-dose irradiation in W and W-3Re alloys were observed using a transmission electron microscope (TEM). Dislocation loops with a size larger than 10 nm could be found in both W and W-3Re alloy, but the distribution of them was different. The distribution of the dislocation loops was more uniform in pure W, while they seemed to be clustered around some locations in W-3Re alloy. Voids (~2.4 nm) were observed in W-3Re alloy, while no void was investigated in W. High-dose irradiation induced obvious hardening with the hardening rate between 75% and 155% in all W-xRe alloys, but W-3Re alloy had the lowest hardening rate (75%). The main reasons might be related to the smallest grain size in W-3Re alloy, which suppressed the formation of defect clusters and induced smaller hardening than that in other samples.
采用100 dpa的硅辐照剂量来研究嬗变铼含量对W-xRe(x = 0、1、3、5和10 wt.%)合金在550℃下辐照微观缺陷和硬化的影响。铼含量的增加可显著细化W-xRe合金中的晶粒,并且通过扫描电子显微镜(SEM)在高剂量辐照后未发现明显的表面形貌变化。使用透射电子显微镜(TEM)观察了高剂量辐照在W和W-3Re合金中诱导产生的微观缺陷。在W和W-3Re合金中均能发现尺寸大于10 nm的位错环,但它们的分布不同。纯W中位错环的分布更均匀,而在W-3Re合金中它们似乎聚集在某些位置周围。在W-3Re合金中观察到了空洞(约2.4 nm),而在W中未检测到空洞。高剂量辐照在所有W-xRe合金中均诱导出明显的硬化,硬化率在75%至155%之间,但W-3Re合金的硬化率最低(75%)。主要原因可能与W-3Re合金中最小的晶粒尺寸有关,这抑制了缺陷团簇的形成,并且比其他样品产生的硬化更小。