通过后固化工艺对环氧树脂/聚酰亚胺共混物进行热学和力学表征

Thermal and Mechanical Characterization of Epoxy/Polyimide Blends via Postcuring Process.

作者信息

Lee Yong-Min, Kim Kwan-Woo, Kim Byung-Joo

机构信息

Convergence Research Division, Korea Carbon Industry Promotion Agency, Jeonju 54852, Republic of Korea.

Department of Carbon-Nanomaterials Engineering, Jeonju University, Jeonju 55069, Republic of Korea.

出版信息

Polymers (Basel). 2023 Feb 21;15(5):1072. doi: 10.3390/polym15051072.

DOI:10.3390/polym15051072

PMID:36904313

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10007675/

Abstract

In this study, the effects of polyimide (PI) content and postcuring on thermal and mechanical properties in PI and epoxy (EP) blending systems were investigated. EP/PI (EPI) blending reduced the crosslinking density and improved the flexural and impact strength due to ductility. On the other hand, in the postcuring of EPI, the thermal resistance improved due to the increased crosslinking density and the flexural strength increased by up to 57.89% due to the enhanced stiffness, but the impact strength decreased by up to 59.54%. EPI blending induced the improvement in the mechanical properties of EP, and the postcuring process of EPI was shown to be an effective method to improve heat resistance. It was confirmed that EPI blending induces improvement in the mechanical properties of EP, and the postcuring process of EPI is an effective method for improving heat resistance.

摘要

在本研究中，研究了聚酰亚胺（PI）含量和后固化对PI与环氧树脂（EP）共混体系热性能和力学性能的影响。EP/PI（EPI）共混降低了交联密度，并由于延展性提高了弯曲强度和冲击强度。另一方面，在EPI的后固化过程中，由于交联密度增加，耐热性提高，并且由于刚度增强，弯曲强度提高了57.89%，但冲击强度下降了59.54%。EPI共混使EP的力学性能得到改善，并且EPI的后固化过程被证明是提高耐热性的有效方法。证实了EPI共混可改善EP的力学性能，并且EPI的后固化过程是提高耐热性的有效方法。