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探究氧化铟在铜催化剂上对一氧化碳电化学还原过程中提高选择性的作用。

Probing the Roles of Indium Oxides on Copper Catalysts for Enhanced Selectivity during CO-to-CO Electrochemical Reduction.

作者信息

Jia Yanyan, Hsu Hua-Shan, Huang Wan-Chun, Lee Da-Wei, Lee Sheng-Wei, Chen Tsan-Yao, Zhou Lihui, Wang Jeng-Han, Wang Kuan-Wen, Dai Sheng

机构信息

Key Laboratory for Advanced Materials and Feringa Nobel Prize Scientist Joint Research Center, School of Chemistry & Molecular Engineering, East China University of Science and Technology, Shanghai 200237, P. R. China.

Department of Chemistry, National Taiwan Normal University, Taipei 116, Taiwan.

出版信息

Nano Lett. 2023 Mar 22;23(6):2262-2268. doi: 10.1021/acs.nanolett.2c04925. Epub 2023 Mar 13.

Abstract

The electrochemical CO reduction reaction (CORR) provides an alternative protocol to producing industrial chemicals with renewable electricity sources, and the highly selective, durable, and economic catalysts should expedite CORR applications. Here, we demonstrate a composite Cu-InO catalyst in which a trace amount of InO decorated on Cu surface greatly improves the selectivity and stability for CO-to-CO reduction as compared to the counterparts (Cu or InO), realizing a CO faradaic efficiency (FE) of 95% at -0.7 V (vs RHE) and no obvious degradation within 7 h. X-ray absorption spectroscopy reveals that InO undergoes the redox reaction and preserves the metallic state of Cu during the CORR process. Strong electronic interaction and coupling occur at the Cu/InO interface which serves as the active site for selective CORR. Theoretical calculation confirms the roles of InO in preventing oxidation and altering the electronic structure of Cu to assist COOH* formation and demote CO* adsorption at the Cu/InO interface.

摘要

电化学CO还原反应(CORR)为利用可再生电源生产工业化学品提供了一种替代方案,而高选择性、耐用性和经济性的催化剂应能加速CORR的应用。在此,我们展示了一种复合Cu-InO催化剂,其中在Cu表面修饰的微量InO与对应物(Cu或InO)相比,极大地提高了CO还原为CO的选择性和稳定性,在-0.7 V(相对于可逆氢电极)时实现了95%的CO法拉第效率(FE),并且在7小时内没有明显降解。X射线吸收光谱表明,InO发生氧化还原反应,并在CORR过程中保持Cu的金属状态。在作为选择性CORR活性位点的Cu/InO界面处发生了强烈的电子相互作用和耦合。理论计算证实了InO在防止氧化以及改变Cu的电子结构以协助COOH形成并减少CO在Cu/InO界面处吸附方面的作用。

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