Cheng Na, Sun Zhi, Yu Xiaohui, Yu Qianzhen, Zhao Jianwei
College of Material and Textile Engineering, Key Laboratory of Yarn Materials Forming and Composite Processing Technology, Jiaxing University, Jiaxing 314001, Zhejiang, China.
College of Design, Jiaxing University, Jiaxing 314001, Zhejiang, China.
Phys Chem Chem Phys. 2023 Apr 5;25(14):10022-10032. doi: 10.1039/d3cp00209h.
To impart conductivity and improve the shear performance of epoxy resin-based adhesives, a simple, environmentally friendly, and stable method was used to deposit silver on the surface of 5 μm flake copper particles as a conductive filler. The core-shell metal fillers were prepared by utilizing the autocatalytic properties of Cu without adding any reducing agent during the reaction. An epoxy curing agent (MeTHPA) was used as a curing agent for the crosslinking reaction with epoxy resin to form a supporting skeleton of conductive components. The structure of flake plated Cu@Ag particles was characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy dispersive spectroscopy (EDS). It was verified that a layer of compact and crystalline silver with a concave-convex characteristic was deposited on the surface of copper particles. This feature has a positive effect on improving the performance of silver-plated copper particles. The results show that the optimal curing condition of flake plated Cu@Ag particle-epoxy composite electrically conductive adhesives (ECAs) was 200 °C for 1 h, the resistivity of flake plated Cu@Ag particle-epoxy composite ECAs with a content of flake plated Cu@Ag particles above 55 wt% was less than 6 × 10 Ω m, and the maximum shear strength was 8 MPa. The flake plated Cu@Ag particle-epoxy composite ECAs prepared by this method have excellent properties and have very important application value for advanced electronic devices.
为赋予环氧树脂基胶粘剂导电性并改善其剪切性能，采用一种简单、环保且稳定的方法在5μm片状铜颗粒表面沉积银作为导电填料。利用铜的自催化特性在反应过程中不添加任何还原剂制备核壳型金属填料。使用环氧固化剂（甲基四氢苯酐，MeTHPA）作为与环氧树脂交联反应的固化剂，以形成导电组分的支撑骨架。利用扫描电子显微镜（SEM）、X射线衍射（XRD）和能谱仪（EDS）对片状镀铜@银颗粒的结构进行表征。证实了在铜颗粒表面沉积了一层具有凹凸特征的致密结晶银。该特征对提高镀银铜颗粒的性能有积极作用。结果表明，片状镀铜@银颗粒-环氧复合导电胶粘剂（ECAs）的最佳固化条件为200℃1h，片状镀铜@银颗粒含量高于55wt%的片状镀铜@银颗粒-环氧复合ECAs的电阻率小于6×10Ω·m，最大剪切强度为8MPa。通过该方法制备的片状镀铜@银颗粒-环氧复合ECAs具有优异的性能，对先进电子器件具有非常重要的应用价值。
