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磨削参数对氮化硅陶瓷加工温度、裂纹扩展及残余应力的影响

Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics.

作者信息

Yan Haipeng, Deng Fei, Qin Zhiying, Zhu Jinda, Chang Hongjie, Niu Huli

机构信息

School of Mechanical Engineering, Hebei University of Science and Technology, Shijiazhuang 050018, China.

出版信息

Micromachines (Basel). 2023 Mar 16;14(3):666. doi: 10.3390/mi14030666.

DOI:10.3390/mi14030666
PMID:36985073
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10052180/
Abstract

The surface/subsurface damage of engineering ceramics after machining has a great influence on the service performance of parts. In order to obtain a high grinding surface quality of engineering ceramics, and take silicon nitride ceramic as a research object, a series of grinding experiments were carried out. The effects of grinding parameters on longitudinal crack propagation depth and the surface residual stress of silicon nitride ceramics were analyzed by grinding experiments, and the residual stress at the location of crack propagation was obtained. The variation in the grinding temperature under different grinding parameters was explored. The influences of the grinding temperature on crack propagation depth and surface residual stress were clarified, the distribution of residual stress along the depth direction was discussed, and the relationship between the residual stress and crack propagation was revealed. The results show that the residual compressive stress on the surface of silicon nitride ceramics decreases with the increase in the depth of crack propagation and the degree of surface brittle spalling. The residual stress at the location of the crack propagation was residual tensile stress. The crack propagation depth increased with the increase in the residual tensile stress. The research provides a reference for the realization of high-quality surfaces in the grinding of silicon nitride ceramics.

摘要

工程陶瓷加工后的表面/亚表面损伤对零件的服役性能有很大影响。为了获得工程陶瓷高磨削表面质量,以氮化硅陶瓷为研究对象,进行了一系列磨削实验。通过磨削实验分析了磨削参数对氮化硅陶瓷纵向裂纹扩展深度和表面残余应力的影响,得到了裂纹扩展位置的残余应力。探讨了不同磨削参数下磨削温度的变化情况。阐明了磨削温度对裂纹扩展深度和表面残余应力的影响,讨论了残余应力沿深度方向的分布,揭示了残余应力与裂纹扩展之间的关系。结果表明,氮化硅陶瓷表面的残余压应力随着裂纹扩展深度和表面脆性剥落程度的增加而减小。裂纹扩展位置的残余应力为残余拉应力。裂纹扩展深度随着残余拉应力的增加而增大。该研究为实现氮化硅陶瓷高质量磨削表面提供了参考。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/2301ece845ff/micromachines-14-00666-g012.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/816e296ad00b/micromachines-14-00666-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/2301ece845ff/micromachines-14-00666-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/0482da0a1d07/micromachines-14-00666-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/1067a092a982/micromachines-14-00666-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/69694fe2f1f4/micromachines-14-00666-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/62c954b78e2d/micromachines-14-00666-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/d610fb305317/micromachines-14-00666-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/254389e35517/micromachines-14-00666-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/dab2b515fcdd/micromachines-14-00666-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/5389356681e2/micromachines-14-00666-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/ac150b0a6122/micromachines-14-00666-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/a413386a984f/micromachines-14-00666-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/816e296ad00b/micromachines-14-00666-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/78ba/10052180/2301ece845ff/micromachines-14-00666-g012.jpg

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