Antennas and Propagation Lab (APL), Instituto de Telecomunicaciones y Aplicaciones Multimedia (iTEAM), Universitat Politècnica de València (UPV), C/ Camí de Vera s/n, 46022 Valencia, Spain.
Sensors (Basel). 2023 Mar 10;23(6):3007. doi: 10.3390/s23063007.
This paper presents a very low-profile on-ground chip antenna with a total volume of 0.075λ0× 0.056λ0× 0.019λ0 (at f0 = 2.4 GHz). The proposed design is a corrugated (accordion-like) planar inverted F antenna (PIFA) embedded in low-loss glass ceramic material (DuPont GreenTape 9k7 with ϵr = 7.1 and tanδ = 0.0009) fabricated with LTCC technology. The antenna does not require a clearance area on the ground plane where the antenna is located, and it is proposed for 2.4 GHz IoT applications for extreme size-limited devices. It shows a 25 MHz impedance bandwidth (for S11 < -6 dB), which means a relative bandwidth of 1%). A study in terms of matching and total efficiency is performed for several size ground planes with the antenna installed at different positions. The use of characteristic modes analysis (CMA) and the correlation between modal and total radiated fields is performed to demonstrate the optimum position of the antenna. Results show high-frequency stability and a total efficiency difference of up to 5.3 dB if the antenna is not placed at the optimum position.
本文提出了一种总体积为 0.075λ0×0.056λ0×0.019λ0(在 f0 = 2.4 GHz 时)的非常低剖面的地面芯片天线。该设计是一种嵌入在低损耗玻璃陶瓷材料(DuPont GreenTape 9k7,εr = 7.1,tanδ = 0.0009)中的波纹(手风琴状)平面倒 F 天线(PIFA),采用 LTCC 技术制造。该天线不需要在天线所在的地面上留出净空区域,它专为 2.4 GHz IoT 应用中的极端尺寸受限设备而设计。它显示出 25 MHz 的阻抗带宽(S11 < -6 dB),这意味着相对带宽为 1%。对安装在不同位置的天线的几个尺寸的接地面进行了匹配和总效率方面的研究。使用特征模式分析(CMA)和模式与总辐射场之间的相关性来演示天线的最佳位置。结果表明,如果天线未放置在最佳位置,高频稳定性和总效率差异高达 5.3 dB。