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直接喷墨打印嵌入无线温度和相对湿度传感器的陶瓷粘土。

Direct Ink-Write Printing of Ceramic Clay with an Embedded Wireless Temperature and Relative Humidity Sensor.

机构信息

Department of Mechanical Engineering, The University of Texas at El Paso, El Paso, TX 79968, USA.

W.M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX 79968, USA.

出版信息

Sensors (Basel). 2023 Mar 22;23(6):3352. doi: 10.3390/s23063352.

Abstract

This research presents a simple method to additively manufacture Cone 5 porcelain clay ceramics by using the direct ink-write (DIW) printing technique. DIW has allowed the application of extruding highly viscous ceramic materials with relatively high-quality and good mechanical properties, which additionally allows a freedom of design and the capability of manufacturing complex geometrical shapes. Clay particles were mixed with deionized (DI) water at different ratios, where the most suitable composition for 3D printing was observed at a 1:5 w/c ratio (16.2 wt.%. of DI water). Differential geometrical designs were printed to demonstrate the printing capabilities of the paste. In addition, a clay structure was fabricated with an embedded wireless temperature and relative humidity (RH) sensor during the 3D printing process. The embedded sensor read up to 65% RH and temperatures of up to 85 °F from a maximum distance of 141.7 m. The structural integrity of the selected 3D printed geometries was confirmed through the compressive strength of fired and non-fired clay samples, with strengths of 70 MPa and 90 MPa, respectively. This research demonstrates the feasibility of using the DIW printing of porcelain clay with embedded sensors, with fully functional temperature- and humidity-sensing capabilities.

摘要

本研究提出了一种通过直接墨水书写(DIW)打印技术来增材制造 Cone 5 瓷土陶瓷的简单方法。DIW 允许挤出具有相对高质量和良好机械性能的高粘度陶瓷材料,这还允许设计自由度和制造复杂几何形状的能力。将粘土颗粒与去离子(DI)水以不同的比例混合,在 1:5 w/c 比例(16.2 wt.%的 DI 水)下观察到最适合 3D 打印的组成。打印了不同的几何设计,以展示糊剂的打印能力。此外,在 3D 打印过程中,使用嵌入式无线温度和相对湿度(RH)传感器制造了一个粘土结构。嵌入式传感器可从 141.7 m 的最大距离读取高达 65%RH 和高达 85°F 的温度。通过烧制和未烧制的粘土样品的抗压强度来确认所选 3D 打印几何形状的结构完整性,其强度分别为 70 MPa 和 90 MPa。这项研究证明了使用嵌入式传感器的 DIW 打印瓷土的可行性,具有完全功能的温度和湿度感应能力。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0101/10056007/f55f2b3dfd97/sensors-23-03352-g001.jpg

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