College of Materials Science and Chemical Engineering, Harbin Engineering University, Harbin, 150001, P. R. China.
Yantai Research Institute and Graduate School of Harbin Engineering University, Yantai, 265000, P. R. China.
Macromol Rapid Commun. 2023 Jul;44(13):e2300060. doi: 10.1002/marc.202300060. Epub 2023 May 19.
Currently, heat accumulation has seriously affected the stabilities and life of electronic devices. Polyimide (PI) film with high thermal conductivity coefficient (λ) has long been held up as an ideal solution for heat dissipation. Based on the thermal conduction mechanisms and classical thermal conduction models, this review presents design ideas of PI films with microscopically ordered liquid crystalline structures which are of great significance for breaking the limit of λ enhancement and describes the construction principles of thermal conduction network in high-λ filler strengthened PI films. Furthermore, the effects of filler type, thermal conduction paths, and interfacial thermal resistances on thermally conductive behavior of PI film are systematically reviewed. Meanwhile, this paper summarizes the reported research and provides an outlook on the future development of thermally conductive PI films. Finally, it is expected that this review will give some guidance to future studies in thermally conductive PI film.
目前，热量积累严重影响了电子设备的稳定性和寿命。具有高导热系数(λ)的聚酰亚胺(PI)薄膜一直被认为是散热的理想解决方案。基于热传导机制和经典热传导模型，本综述提出了具有微观有序液晶结构的 PI 薄膜的设计思路，这对于突破 λ增强的限制具有重要意义，并描述了高 λ填充剂增强 PI 薄膜中热传导网络的构建原理。此外，还系统地综述了填料类型、热传导路径和界面热阻对 PI 薄膜导热性能的影响。同时，总结了所报道的研究工作，并对导热 PI 薄膜的未来发展进行了展望。最后，希望本文的综述能对导热 PI 薄膜的未来研究提供一些指导。
