Shah Abdul Wahid, Ha Seong-Ho, Siddique Jabir Ali, Kim Bong-Hwan, Yoon Young-Ok, Lim Hyun-Kyu, Kim Shae K
Industrial Technology, University of Science and Technology, Daejeon 34113, Republic of Korea.
Industrial Materials Processing R&D Department, Korea Institute of Industrial Technology, Incheon 21999, Republic of Korea.
Materials (Basel). 2023 Mar 30;16(7):2783. doi: 10.3390/ma16072783.
The aim of this study was to investigate the impact of the addition of a minor quantity of Si on the microstructure evolution, heat treatment response, and mechanical properties of the Al-4.5Cu-0.15Ti-3.0Mg alloy. The microstructure analysis of the base alloy revealed the presence of α-Al grains, eutectic α-Al-AlCuMg (S) phases, and Mg(Al, Cu) (T) phases within the Al grains. In contrast, the Si-added alloy featured the eutectic α-Al-MgSi phases, eutectic α-Al-S-MgSi, and Ti-Si-based intermetallic compounds in addition to the aforementioned phases. The study found that the Si-added alloy had a greater quantity of T phase in comparison to the base alloy, which was attributed to the promotion of T phase precipitation facilitated by the inclusion of Si. Additionally, Si facilitated the formation of S phase during aging treatment, thereby accelerating the precipitation-hardening response of the Si-added alloy. The as-cast temper of the base alloy displayed a yield strength of roughly 153 MPa, which increased to 170 MPa in the Si-added alloy. As a result of the aging treatment, both alloys exhibited a notable increase in tensile strength, which was ascribed to the precipitation of S phases. In the T6 temper, the base alloy exhibited a yield strength of 270 MPa, while the Si-added alloy exhibited a significantly higher yield strength of 324 MPa. This novel Si-added alloy demonstrated superior tensile properties compared to many commercially available high-Mg-added Al-Cu-Mg alloys, making it a potential replacement for such alloys in various applications within the aerospace and automotive industries.
本研究的目的是研究添加少量硅对Al-4.5Cu-0.15Ti-3.0Mg合金微观结构演变、热处理响应及力学性能的影响。对基体合金的微观结构分析表明,在铝晶粒内存在α-Al晶粒、共晶α-Al-AlCuMg(S)相和Mg(Al, Cu)(T)相。相比之下,添加硅的合金除上述相外,还具有共晶α-Al-MgSi相、共晶α-Al-S-MgSi相和Ti-Si基金属间化合物。研究发现,与基体合金相比,添加硅的合金中T相的数量更多,这归因于硅的加入促进了T相的析出。此外,硅在时效处理过程中促进了S相的形成,从而加速了添加硅合金的沉淀硬化响应。基体合金的铸态回火屈服强度约为153MPa,添加硅的合金中该值增加到170MPa。由于时效处理,两种合金的抗拉强度均显著提高,这归因于S相的析出。在T6回火状态下,基体合金的屈服强度为270MPa,而添加硅的合金的屈服强度显著更高,为324MPa。这种新型添加硅合金与许多市售的高镁添加Al-Cu-Mg合金相比,具有优异的拉伸性能,使其成为航空航天和汽车工业中各种应用中此类合金的潜在替代品。