Abdulrhman Mansour, Kaniyoor Adarsh, Fernández-Posada Carmen M, Acosta-Mora Pablo, McLean Ian, Weston Nick, Desmulliez Marc P Y, Marques-Hueso Jose
School of Engineering and Physical Sciences, Institute of Sensors, Signals and Systems, Heriot-Watt University EH14 4AS Edinburgh UK
Department of Physics, Maxwell Centre J. J. Thomson Avenue CB3 0HE Cambridge UK.
Nanoscale Adv. 2023 Mar 18;5(8):2280-2287. doi: 10.1039/d3na00120b. eCollection 2023 Apr 11.
Silver nanoparticle photoreduction synthesis by direct laser writing is a process that enables copper micro-track production on very specific polymers. However, some important 3D printing polymers, such as acrylonitrile butadiene styrene (ABS) and acrylates, do not accept this treatment on their surface. This work presents an approach to produce copper microcircuitry on 3D substrates from these materials by using direct laser writing at low power (32 mW CW diode laser). We show that by coating a thin layer of polyimide (PI) on a 3D-printed geometry, followed by a sequence of chemical treatments and low-power laser-induced photoreduction, copper tracks can be produced using silver as catalyst. The surface chemistry of the layer through the different stages of the process is monitored by FTIR and X-ray photoelectron spectroscopy. The copper tracks are selectively grown on the laser-patterned areas by electroless copper deposition, with conductivity (1.2 ± 0.7) × 10 S m and a width as small as 28 μm. The patterns can be written on 3D structures and even inside cavities. The technique is demonstrated by integrating different circuits, including a LED circuit on 3D printed photopolymer acrylate and a perovskite solar cell on an ABS 3D curved geometry.
通过直接激光写入进行银纳米颗粒光还原合成是一种能够在非常特定的聚合物上制造铜微轨迹的工艺。然而,一些重要的3D打印聚合物,如丙烯腈丁二烯苯乙烯(ABS)和丙烯酸酯,其表面无法接受这种处理。这项工作提出了一种通过使用低功率(32 mW连续波二极管激光器)直接激光写入在由这些材料制成的3D基板上制造铜微电路的方法。我们表明,通过在3D打印的几何形状上涂覆一层聚酰亚胺(PI),然后进行一系列化学处理和低功率激光诱导的光还原,可以使用银作为催化剂来制造铜轨迹。通过傅里叶变换红外光谱(FTIR)和X射线光电子能谱监测该层在工艺不同阶段的表面化学性质。通过化学镀铜在激光图案化区域选择性地生长铜轨迹,其电导率为(1.2 ± 0.7) × 10 S m,宽度小至28 μm。这些图案可以写在3D结构上,甚至可以写在腔体内部。通过集成不同的电路,包括在3D打印的光聚合物丙烯酸酯上的LED电路和在ABS 3D弯曲几何形状上的钙钛矿太阳能电池,展示了该技术。