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用于防沉积导电油墨的酚胺@CuNW 网络的互支撑构建。

Construction of a Reciprocal-Supporting Phenol-amine@CuNW Network for Antisedimentation Conductive Ink.

机构信息

College of Chemistry and Chemical Engineering, Donghua University, Shanghai 201620, China.

Technology Innovation Center of Hebei for fiber material, Shijiazhuang University, Shijiazhuang 050035, Hebei, China.

出版信息

ACS Appl Mater Interfaces. 2023 Jun 7;15(22):27422-27433. doi: 10.1021/acsami.3c05419. Epub 2023 May 23.

DOI:10.1021/acsami.3c05419
PMID:37221852
Abstract

Homogeneously dispersed copper nanowire (CuNW) materials are the basis for practical applications in many types of electronic devices. At present, the dispersion of CuNWs in water is achieved through polymeric spatial site resistance effects primarily and the electrostatic dispersion mechanism in a few. However, the electrical conductivity of CuNWs could be weakened by the excessive addition of polymers; therefore, it is difficult to maintain a stable dispersion enduringly for surface charge modifiers. Based on the coagulation mechanism of colloids, a novel antisedimentation mechanism is refined by this work. Directed by this mechanism, a stable reciprocal-supporting antisedimentation conductive CuNW ink was achieved enduringly and a uniform conductive coating (1.81-5.65 Ω·sq) was successfully manufactured. The tannic acid-polyethylene imine (TA-PEI) could support copper nanowires to maintain a stable height of 61.4% after 15 days best, while CuNWs in other systems would settle completely in one day. Meanwhile, the TA-PEI composite cluster antisedimentation network not only provided massive spatial potential resistance for CuNWs but also modified the surface charge of CuNWs. CuNWs were dispersed stably in this phenol-amine@CuNW network. Furthermore, the CuNWs were crosslinked more tightly with each other relying on the vigorous adhesive properties of TA-PEI. With this antisedimentation mechanism and simple treatment process, CuNW ink will be utilized in more applications.

摘要

均匀分散的铜纳米线 (CuNW) 材料是许多类型电子设备中实际应用的基础。目前,CuNW 在水中的分散主要通过聚合物空间位阻效应实现,少数情况下通过静电分散机制实现。然而,聚合物的过度添加会削弱 CuNW 的导电性;因此,对于表面电荷修饰剂来说,很难持久地保持稳定的分散状态。基于胶体的凝聚机制,本工作提炼了一种新的防沉淀机制。根据该机制,成功制备了一种稳定的互支撑防沉淀导电 CuNW 油墨,并获得了均匀的导电涂层(1.81-5.65 Ω·sq)。单宁酸-聚乙烯亚胺(TA-PEI)可以支撑铜纳米线,使其在 15 天后保持最佳的稳定高度为 61.4%,而其他体系中的 CuNW 在一天内会完全沉淀。同时,TA-PEI 复合团簇防沉淀网络不仅为 CuNW 提供了大量的空间位阻,还修饰了 CuNW 的表面电荷。CuNW 在这种酚胺@CuNW 网络中稳定分散。此外,依靠 TA-PEI 的强烈粘附特性,CuNW 之间的交联更加紧密。借助这种防沉淀机制和简单的处理工艺,CuNW 油墨将在更多的应用中得到利用。

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