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使用划痕探针纳米光刻技术制造忆阻器结构的方法:面向神经形态应用

Approaches for Memristive Structures Using Scratching Probe Nanolithography: Towards Neuromorphic Applications.

作者信息

Tominov Roman V, Vakulov Zakhar E, Avilov Vadim I, Shikhovtsov Ivan A, Varganov Vadim I, Kazantsev Victor B, Gupta Lovi Raj, Prakash Chander, Smirnov Vladimir A

机构信息

Research Laboratory Neuroelectronics and Memristive Nanomaterials (NEUROMENA Lab), Institute of Nanotechnologies, Electronics and Electronic Equipment Engineering, Southern Federal University, Taganrog 347922, Russia.

Department of Radioelectronics and Nanoelectronics, Institute of Nanotechnologies, Electronics and Electronic Equipment Engineering, Southern Federal University, Taganrog 347922, Russia.

出版信息

Nanomaterials (Basel). 2023 May 9;13(10):1583. doi: 10.3390/nano13101583.

Abstract

This paper proposes two different approaches to studying resistive switching of oxide thin films using scratching probe nanolithography of atomic force microscopy (AFM). These approaches allow us to assess the effects of memristor size and top-contact thickness on resistive switching. For that purpose, we investigated scratching probe nanolithography regimes using the Taguchi method, which is known as a reliable method for improving the reliability of the result. The AFM parameters, including normal load, scratch distance, probe speed, and probe direction, are optimized on the photoresist thin film by the Taguchi method. As a result, the pinholes with diameter ranged from 25.4 ± 2.2 nm to 85.1 ± 6.3 nm, and the groove array with a depth of 40.5 ± 3.7 nm and a roughness at the bottom of less than a few nanometers was formed. Then, based on the Si/TiN/ZnO/photoresist structures, we fabricated and investigated memristors with different spot sizes and TiN top contact thickness. As a result, the HRS/LRS ratio, U, and I are well controlled for a memristor size from 27 nm to 83 nm and ranged from ~8 to ~128, from 1.4 ± 0.1 V to 1.8 ± 0.2 V, and from (1.7 ± 0.2) × 10 A to (4.2 ± 0.6) × 10 A, respectively. Furthermore, the HRS/LRS ratio and U are well controlled at a TiN top contact thickness from 8.3 ± 1.1 nm to 32.4 ± 4.2 nm and ranged from ~22 to ~188 and from 1.15 ± 0.05 V to 1.62 ± 0.06 V, respectively. The results can be used in the engineering and manufacturing of memristive structures for neuromorphic applications of brain-inspired artificial intelligence systems.

摘要

本文提出了两种不同的方法,用于使用原子力显微镜(AFM)的划痕探针纳米光刻技术研究氧化物薄膜的电阻开关。这些方法使我们能够评估忆阻器尺寸和顶部接触厚度对电阻开关的影响。为此,我们使用田口方法研究了划痕探针纳米光刻工艺,该方法是一种提高结果可靠性的可靠方法。通过田口方法在光刻胶薄膜上优化了包括法向载荷、划痕距离、探针速度和探针方向在内的AFM参数。结果,形成了直径范围为25.4±2.2nm至85.1±6.3nm的针孔,以及深度为40.5±3.7nm且底部粗糙度小于几纳米的沟槽阵列。然后,基于Si/TiN/ZnO/光刻胶结构,我们制造并研究了具有不同光斑尺寸和TiN顶部接触厚度的忆阻器。结果,对于尺寸从27nm到83nm的忆阻器,高电阻状态/低电阻状态比、U和I得到了很好的控制,范围分别为8至128、1.4±0.1V至1.8±0.2V以及(1.7±0.2)×10 A至(4.2±0.6)×10 A。此外,对于TiN顶部接触厚度从8.3±1.1nm到32.4±4.2nm的情况,高电阻状态/低电阻状态比和U也得到了很好的控制,范围分别为22至188和1.15±0.05V至1.62±0.06V。这些结果可用于受脑启发的人工智能系统的神经形态应用的忆阻结构的工程和制造。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2130/10223422/0b72ca95f701/nanomaterials-13-01583-g001.jpg

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