Xiong Chuanyin, Wang Tianxu, Zhang Yongkang, Duan Chao, Zhang Zhao, Zhou Qiusheng, Xiong Qing, Zhao Mengjie, Wang Bo, Ni Yonghao
College of Bioresources Chemical & Materials Engineering, Shaanxi University of Science and Technology, Xi'an 710021, China.
Department of Chemical and Biomedical Engineering, The University of Maine, Orono, Maine 04469, United States.
ACS Appl Mater Interfaces. 2023 Jul 19;15(28):33763-33773. doi: 10.1021/acsami.3c06926. Epub 2023 Jul 9.
With the continuous improvement of living standards and advancements in science and technology, composite materials with multiple functionalities are gaining high practical value in modern society. In this paper, we present a multifunctional conductive paper-based composite with electromagnetic (EMI) shielding, sensing, Joule heating, and antimicrobial properties. The composite is prepared by growing metallic silver nanoparticles inside the cellulose paper (CP) modified with polydopamine (PDA). The resulting CP@PDA@Ag (CPPA) composite has high conductivity and EMI shielding properties. Furthermore, CPPA composites demonstrate exceptional sensing, Joule heating, and antimicrobial properties. In addition, Vitrimer, a polymer with excellent cross-linked network structure, is introduced into CPPA composites to obtain CPPA-V intelligent electromagnetic shielding materials with shape memory function. These excellent properties show that the prepared multifunctional intelligent composite has exceptional EMI shielding, sensing, Joule heating, and antibacterial and shape memory properties. In short, this multifunctional intelligent composite material has great application prospects in flexible wearable electronics.
随着生活水平的不断提高和科技的进步，具有多种功能的复合材料在现代社会中具有很高的实用价值。在本文中，我们展示了一种具有电磁干扰（EMI）屏蔽、传感、焦耳加热和抗菌性能的多功能导电纸基复合材料。该复合材料是通过在经聚多巴胺（PDA）改性的纤维素纸（CP）内部生长金属银纳米颗粒制备而成。所得的CP@PDA@Ag（CPPA）复合材料具有高导电性和EMI屏蔽性能。此外，CPPA复合材料还表现出卓越的传感、焦耳加热和抗菌性能。此外，将具有优异交联网络结构的聚合物 Vitrimer 引入 CPPA 复合材料中，以获得具有形状记忆功能的 CPPA-V 智能电磁屏蔽材料。这些优异性能表明所制备的多功能智能复合材料具有卓越的EMI屏蔽、传感、焦耳加热以及抗菌和形状记忆性能。简而言之，这种多功能智能复合材料在柔性可穿戴电子领域具有广阔的应用前景。
