Dong Jin, Lin Jing, Zhang Hebai, Wang Jun, Li Ye, Pan Kelin, Zhang Haichen, Hu Dechao
School of Applied Physics and Materials, Wuyi University, Jiangmen 529020, China.
School of Materials and Energy, Foshan University, Foshan 528000, China.
Molecules. 2024 Aug 23;29(17):4000. doi: 10.3390/molecules29174000.
Developing multifunctional flexible composites with high-performance electromagnetic interference (EMI) shielding, thermal management, and sensing capacity is urgently required but challenging for next-generation smart electronic devices. Herein, novel nacre-like aramid nanofibers (ANFs)-based composite films with an anisotropic layered microstructure were prepared via vacuum-assisted filtration and hot-pressing. The formed 3D conductive skeleton enabled fast electron and phonon transport pathways in the composite films. As a result, the composite films showed a high electrical conductivity of 71.53 S/cm and an outstanding thermal conductivity of 6.4 W/m·K when the mass ratio of ANFs to MXene/AgNWs was 10:8. The excellent electrical properties and multi-layered structure endowed the composite films with superior EMI shielding performance and remarkable Joule heating performance, with a surface temperature of 78.3 °C at a voltage of 2.5 V. Additionally, it was found that the composite films also exhibited excellent mechanical properties and outstanding flame resistance. Moreover, the composite films could be further designed as strain sensors, which show great promise in monitoring real-time signals for human motion. These satisfactory results may open up a new opportunity for EMI shielding, thermal management, and sensing applications in wearable electronic devices.
开发具有高性能电磁干扰（EMI）屏蔽、热管理和传感能力的多功能柔性复合材料，对于下一代智能电子设备来说是迫切需要但又具有挑战性的。在此，通过真空辅助过滤和热压制备了具有各向异性层状微观结构的新型类珍珠层芳纶纳米纤维（ANFs）基复合薄膜。形成的三维导电骨架在复合薄膜中实现了快速的电子和声子传输路径。结果，当ANFs与MXene/AgNWs的质量比为10:8时，复合薄膜表现出71.53 S/cm的高电导率和6.4 W/m·K的出色热导率。优异的电学性能和多层结构赋予了复合薄膜卓越的EMI屏蔽性能和显著的焦耳热性能，在2.5 V电压下表面温度可达78.3°C。此外，发现复合薄膜还具有优异的机械性能和出色的阻燃性。而且，复合薄膜可以进一步设计成应变传感器，在监测人体运动实时信号方面显示出巨大潜力。这些令人满意的结果可能为可穿戴电子设备中的EMI屏蔽、热管理和传感应用开辟新的机会。
