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使用中子深度剖析技术测量纳米级薄膜厚度

Measurement of Nanoscale Film Thickness Using Neutron Depth Profiling Technique.

作者信息

Zhao Liang, Xiao Caijin, Yao Yonggang, Jin Xiangchun

机构信息

Department of Nuclear Physics, China Institute of Atomic Energy, Beijing 102413, China.

出版信息

ACS Appl Mater Interfaces. 2023 Jul 26;15(29):35639-35647. doi: 10.1021/acsami.3c04980. Epub 2023 Jul 11.

DOI:10.1021/acsami.3c04980
PMID:37432865
Abstract

Determination of geometric parameters for thin film materials has always been a critical concern in scientific research. This paper proposes a novel approach for high-resolution and nondestructive measurement of nanoscale film thickness. In this study, the neutron depth profiling (NDP) technique was employed to accurately measure the thickness of nanoscale Cu films, achieving an impressive resolution of up to 1.78 nm/keV. The measurement results exhibited a deviation from the actual thickness of less than 1%, highlighting the accuracy of the proposed method. Additionally, simulations were conducted on graphene samples to demonstrate the applicability of NDP in measuring the thickness of multilayer graphene films. These simulations provide a theoretical foundation for subsequent experimental measurements, further enhancing the validity and practicality of the proposed technique.

摘要

薄膜材料几何参数的测定一直是科学研究中的关键问题。本文提出了一种用于纳米级薄膜厚度的高分辨率无损测量的新方法。在本研究中,采用中子深度剖析(NDP)技术精确测量纳米级铜膜的厚度,实现了高达1.78 nm/keV的令人印象深刻的分辨率。测量结果显示与实际厚度的偏差小于1%,突出了所提方法的准确性。此外,对石墨烯样品进行了模拟,以证明NDP在测量多层石墨烯膜厚度方面的适用性。这些模拟为后续的实验测量提供了理论基础,进一步提高了所提技术的有效性和实用性。

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