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含不同三氟甲基的低介电常数环氧树脂性能比较

Comparison of the Properties of Epoxy Resins Containing Various Trifluoromethyl Groups with Low Dielectric Constant.

作者信息

Zhang Yurong, Lin Haidan, Dong Kai, Tang Shasha, Zhao Chengji

机构信息

Key Laboratory of High Performance Plastics, Ministry of Education, College of Chemistry, Jilin University, Changchun 130012, China.

Electric Power Research Institute, State Grid Jilin Electric Power Company, Changchun 130012, China.

出版信息

Polymers (Basel). 2023 Jun 28;15(13):2853. doi: 10.3390/polym15132853.

DOI:10.3390/polym15132853
PMID:37447498
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10346801/
Abstract

A series of epoxy resins containing various trifluoromethyl groups were synthesized and thermally cured with diaminodiphenylmethane (DDM) and aminophenyl sulfone (DDS). All epoxy resins exhibited excellent thermal stability with the glass transition temperatures of above 128 °C and 5% weight loss temperatures of above 300 °C. DDS-cured epoxy resins possessed higher thermal stability than that of DDM-cured epoxy resins, while DDM-cured epoxy resins showed better mechanical, dielectric, and hydrophobic properties. Additionally, DDM-cured epoxy resins with different locations and numbers of trifluoromethyl groups showed flexural strength in the range of 95.55152.36 MPa, flexural modulus in the range of 1.712.65 GPa, dielectric constant in the range of 2.553.05, and water absorption in the range of 0.490.95%. These results indicate that the incorporation of trifluoromethyl pendant groups into epoxy resins can be a valid strategy to improve the dielectric and hydrophobic performance.

摘要

合成了一系列含有不同三氟甲基的环氧树脂，并用二氨基二苯甲烷（DDM）和氨基苯砜（DDS）进行热固化。所有环氧树脂均表现出优异的热稳定性，玻璃化转变温度高于128℃，5%失重温度高于300℃。DDS固化的环氧树脂比DDM固化的环氧树脂具有更高的热稳定性，而DDM固化的环氧树脂表现出更好的机械、介电和疏水性能。此外，具有不同位置和数量三氟甲基的DDM固化环氧树脂的弯曲强度在95.55152.36MPa范围内，弯曲模量在1.712.65GPa范围内，介电常数在2.553.05范围内，吸水率在0.490.95%范围内。这些结果表明，将三氟甲基侧基引入环氧树脂中可以是提高介电和疏水性能的有效策略。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/2d6e96ffb847/polymers-15-02853-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/b92fd8327575/polymers-15-02853-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/547eb4f2f8ca/polymers-15-02853-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/4b91e97364ce/polymers-15-02853-g003a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/5030e41f8cc3/polymers-15-02853-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/37aa2e547036/polymers-15-02853-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/bb1f616f1e0d/polymers-15-02853-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/2d6e96ffb847/polymers-15-02853-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/b92fd8327575/polymers-15-02853-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/547eb4f2f8ca/polymers-15-02853-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/4b91e97364ce/polymers-15-02853-g003a.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/5030e41f8cc3/polymers-15-02853-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/37aa2e547036/polymers-15-02853-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/bb1f616f1e0d/polymers-15-02853-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a3b8/10346801/2d6e96ffb847/polymers-15-02853-g007.jpg

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