Kim Young-Hun, Baek Jeong Ju, Chang Ki Cheol, Park Baek Soo, Koh Won-Gun, Shin Gyojic
Green and Sustainable Materials R&D Department, Research Institute of Clean Manufacturing System, Korea Institute of Industrials Technology (KITECH), Yangdaegiro-gil 89, Ipjang-myeon, Cheonan-si 31056, Republic of Korea.
Department of Chemical and Biomolecular Engineering, Yonsei University, Yonsei-ro 50, Seodaemun-gu, Seoul 03722, Republic of Korea.
Polymers (Basel). 2023 Jul 4;15(13):2947. doi: 10.3390/polym15132947.
A novel thiol-functionalized polysilsesqioxane containing hydroxyl and methyl groups was synthesized using a simple acid-catalyzed sol-gel method to develop an epoxy hardener with low odor, low volatile organic compound (VOC) emissions, and fast curing at low temperatures. The synthesized thiol-based hardeners were characterized using Fourier transform infrared spectroscopy, nuclear magnetic resonance, thermogravimetric analysis (TGA), and gel permeation chromatography and compared with commercially available hardeners in terms of odor intensity and VOC emissions using the air dilution olfaction method and VOC analysis. The curing behavior and thermal and mechanical properties of the epoxy compounds prepared with the synthesized thiol-based hardeners were also evaluated. The results showed that synthetic thiol-based hardeners containing methyl and hydroxyl groups initiated the curing reaction of epoxy compounds at 53 °C and 45 °C, respectively. In contrast, commercial thiol-based hardeners initiated the curing reaction at 67 °C. Additionally, epoxy compounds with methyl-containing synthetic thiol-based hardeners exhibited higher TGA at a 5% weight loss temperature (>50 °C) and lap shear strength (20%) than those of the epoxy compounds with commercial thiol-based hardeners.
采用简单的酸催化溶胶-凝胶法合成了一种新型的含羟基和甲基的硫醇官能化聚倍半硅氧烷,以开发一种低气味、低挥发性有机化合物(VOC)排放且能在低温下快速固化的环氧固化剂。使用傅里叶变换红外光谱、核磁共振、热重分析(TGA)和凝胶渗透色谱对合成的硫醇基固化剂进行了表征,并采用空气稀释嗅觉法和VOC分析,在气味强度和VOC排放方面与市售固化剂进行了比较。还评估了用合成的硫醇基固化剂制备的环氧化合物的固化行为以及热性能和机械性能。结果表明,含甲基和羟基的合成硫醇基固化剂分别在53℃和45℃引发环氧化合物的固化反应。相比之下,市售硫醇基固化剂在67℃引发固化反应。此外,含甲基的合成硫醇基固化剂的环氧化合物在5%失重温度(>50℃)下的TGA和搭接剪切强度(20%)均高于市售硫醇基固化剂的环氧化合物。