• 文献检索
  • 文档翻译
  • 深度研究
  • 学术资讯
  • Suppr Zotero 插件Zotero 插件
  • 邀请有礼
  • 套餐&价格
  • 历史记录
应用&插件
Suppr Zotero 插件Zotero 插件浏览器插件Mac 客户端Windows 客户端微信小程序
定价
高级版会员购买积分包购买API积分包
服务
文献检索文档翻译深度研究API 文档MCP 服务
关于我们
关于 Suppr公司介绍联系我们用户协议隐私条款
关注我们

Suppr 超能文献

核心技术专利：CN118964589B侵权必究
粤ICP备2023148730 号-1Suppr @ 2026

文献检索

告别复杂PubMed语法，用中文像聊天一样搜索，搜遍4000万医学文献。AI智能推荐，让科研检索更轻松。

立即免费搜索

文件翻译

保留排版，准确专业，支持PDF/Word/PPT等文件格式，支持 12+语言互译。

免费翻译文档

深度研究

AI帮你快速写综述，25分钟生成高质量综述，智能提取关键信息，辅助科研写作。

立即免费体验

铜衬底上铟固态界面反应的长期老化研究

Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate.

作者信息

Hung Han-Tang, Chang Fu-Ling, Tsai Chin-Hao, Liao Chia-Yi, Kao C R

机构信息

Department of Materials Science & Engineering, National Taiwan University, Taipei 10617, Taiwan.

出版信息

Materials (Basel). 2023 Sep 18;16(18):6263. doi: 10.3390/ma16186263.

DOI:10.3390/ma16186263
PMID:37763541
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10532517/
Abstract

Indium is considered a candidate low-temperature solder because of its low melting temperature and excellent mechanical properties. However, the solid-state microstructure evolution of In with different substrates has rarely been studied due to the softness of In. To overcome this difficulty, cryogenic broad Ar beam ion polishing was used to produce an artifact-free Cu/In interface for observation. In this study, we accomplished phase identification and microstructure investigation at the Cu/In interface after long-term thermal aging. CuIn was observed to grow at the Cu/In interface and proved to be a stable phase in the Cu-In binary system. The peritectoid temperature of the CuIn + In → CuIn reaction was confirmed to be between 100 and 120 °C. In addition, the growth rate of CuIn was discovered to be dominated by the curvature of the reactant CuIn/In phase and the temperature difference with the peritectoid temperature. Finally, a comprehensive microstructural evolution mechanism of the Cu/In solid-state interfacial reaction was proposed.

摘要

铟因其低熔点温度和优异的机械性能而被认为是一种低温焊料候选材料。然而，由于铟的柔软性，不同衬底上铟的固态微观结构演变很少被研究。为了克服这一困难，采用低温宽幅氩束离子抛光技术制备了无假象的铜/铟界面用于观察。在本研究中，我们完成了长期热老化后铜/铟界面的相鉴定和微观结构研究。观察到CuIn在铜/铟界面处生长，并被证明是铜-铟二元体系中的一个稳定相。CuIn + In → CuIn反应的包析温度被确定在100至120℃之间。此外，发现CuIn的生长速率受反应物CuIn/In相的曲率和与包析温度的温差支配。最后，提出了铜/铟固态界面反应的综合微观结构演变机制。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/45954c79b381/materials-16-06263-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/d0d2f5597e8d/materials-16-06263-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/356401d7d847/materials-16-06263-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/a8de0f8ca402/materials-16-06263-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/30e24148ba41/materials-16-06263-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/478cd62d1b17/materials-16-06263-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/56a64d5ad27e/materials-16-06263-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/bb20e471eab8/materials-16-06263-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/317df339115d/materials-16-06263-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/0c4bdd7a89ed/materials-16-06263-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/00c1c0d24ef9/materials-16-06263-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/45954c79b381/materials-16-06263-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/d0d2f5597e8d/materials-16-06263-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/356401d7d847/materials-16-06263-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/a8de0f8ca402/materials-16-06263-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/30e24148ba41/materials-16-06263-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/478cd62d1b17/materials-16-06263-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/56a64d5ad27e/materials-16-06263-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/bb20e471eab8/materials-16-06263-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/317df339115d/materials-16-06263-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/0c4bdd7a89ed/materials-16-06263-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/00c1c0d24ef9/materials-16-06263-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8b5a/10532517/45954c79b381/materials-16-06263-g011.jpg

相似文献

1
Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate.铜衬底上铟固态界面反应的长期老化研究
Materials (Basel). 2023 Sep 18;16(18):6263. doi: 10.3390/ma16186263.
2
Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling.使用离子研磨法在共晶In-48Sn与Cu的界面反应中获得无假象微观结构。
Materials (Basel). 2023 Apr 22;16(9):3290. doi: 10.3390/ma16093290.
3
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.采用层层转移石墨烯控制无铅焊点界面的界面反应和金属间化合物生长。
ACS Appl Mater Interfaces. 2016 Mar 2;8(8):5679-86. doi: 10.1021/acsami.5b11903. Epub 2016 Feb 22.
4
Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition.微量锌添加对Sn-10Bi/Cu焊点时效过程中界面演变的影响
Materials (Basel). 2019 Dec 17;12(24):4240. doi: 10.3390/ma12244240.
5
Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.Sn-2.0Ag-1.5Zn低银含量无铅焊球与不同基板焊接界面的微观结构与形态
Heliyon. 2023 Jan 13;9(2):e12952. doi: 10.1016/j.heliyon.2023.e12952. eCollection 2023 Feb.
6
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints.金属间化合物在控制Cu-[Sn-Ag-Cu-Bi]-Cu焊点的微观结构、物理和力学性能中的作用。
Sci Rep. 2019 Jun 10;9(1):8389. doi: 10.1038/s41598-019-44758-3.
7
Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.Sn2.5Ag0.7Cu0.1RE/Cu无铅焊点在等温时效过程中界面金属间化合物演变及断裂机制的动态观察
Materials (Basel). 2020 Feb 12;13(4):831. doi: 10.3390/ma13040831.
8
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.锡铋焊点的界面反应与力学性能
Materials (Basel). 2017 Aug 9;10(8):920. doi: 10.3390/ma10080920.
9
Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints.SnAg3Cu0.5/Cu焊点的时效界面结构与异常拉伸强度
Materials (Basel). 2022 Dec 16;15(24):9004. doi: 10.3390/ma15249004.
10
Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.采用超快激光键合制备的含银纳米颗粒的Sn-58Bi焊点的界面反应与力学性能
Materials (Basel). 2021 Jan 11;14(2):335. doi: 10.3390/ma14020335.

本文引用的文献

1
Compound formation at Cu-In thin-film interfaces detected by perturbed gamma - gamma angular correlations.通过扰动伽马-伽马角关联检测铜铟薄膜界面处的化合物形成。
Phys Rev Lett. 1985 May 27;54(21):2371-2374. doi: 10.1103/PhysRevLett.54.2371.
2
Characterization of phases and determination of phase relations in the Cu-In-S system by gamma - gamma perturbed angular correlations.通过γ-γ扰动角关联对Cu-In-S体系中的相进行表征及相关系的确定。
Phys Rev B Condens Matter. 1991 Dec 1;44(21):11614-11623. doi: 10.1103/physrevb.44.11614.