Fan Zexu, Li Bo, Ren Dengxun, Xu Mingzhen
School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China.
Polymers (Basel). 2023 Sep 29;15(19):3933. doi: 10.3390/polym15193933.
With the rapid advancement of intelligent electronics, big data platforms, and other cutting-edge technologies, traditional low dielectric polymer matrix composites are no longer sufficient to satisfy the application requirements of high-end electronic information materials, particularly in the realm of high integration and high-frequency, high-speed electronic communication device manufacturing. Consequently, resin-based composites with exceptional low dielectric properties have garnered unprecedented attention. In recent years, benzoxazine-based composites have piqued the interest of scholars in the fields of high-temperature-resistant, low dielectric electronic materials due to their remarkable attributes such as high strength, high modulus, high heat resistance, low curing shrinkage, low thermal expansion coefficient, and excellent flame retardancy. This article focuses on the design and development of modification of polybenzoxazine based on low dielectric polybenzoxazine modification methods. Studies on manufacturing polybenzoxazine co-polymers and benzoxazine-based nanocomposites have also been reviewed.
随着智能电子、大数据平台等前沿技术的飞速发展，传统的低介电聚合物基复合材料已不足以满足高端电子信息材料的应用需求，特别是在高集成度以及高频、高速电子通信设备制造领域。因此，具有优异低介电性能的树脂基复合材料受到了前所未有的关注。近年来，基于苯并恶嗪的复合材料因其具有高强度、高模量、高耐热性、低固化收缩率、低热膨胀系数以及优异的阻燃性等显著特性，引起了耐高温、低介电电子材料领域学者的兴趣。本文重点介绍基于低介电聚苯并恶嗪改性方法的聚苯并恶嗪的设计与开发。同时也综述了聚苯并恶嗪共聚物和苯并恶嗪基纳米复合材料的制备研究。
