Lee Pilwoo, Jung Hunsang, Yoo Chan-Sei, Lee Hyun Ho
Department of Chemical Engineering, Myongji University, Yongin-si 17058, Gyeonggi-do, Republic of Korea.
Electronic Convergence Materials & Devices Research Center, Korea Electronics Technology Institute, Seongnam-si 13509, Gyeonggi-do, Republic of Korea.
Polymers (Basel). 2023 Apr 27;15(9):2078. doi: 10.3390/polym15092078.
Recently, due to the intensive and fast progress of the high frequency wireless communication environment, including 5th generation (5G) wireless communication, more robust substrate for printed circuit board (PCB) application, especially with less power consumption, is required. In this study, modified resins based on styrene-maleic anhydride (SMA) copolymer were prepared and evaluated as binder resin to accomplish a low dielectric constant or relative permittivity (ε: <3.0) substrate for the PCB application under ultrahigh frequencies (UHF; 1 GHz~9.4 GHz). The low ε dielectric characteristics of the modified SMA copolymer could be correlated with effects from the stereo-structure of carbon chains or conformational orientation, where the degree of crystallization was analyzed by X-ray diffraction (XRD) and nuclear magnetic resonance (NMR) spectroscopies. Prepreg films of the low ε modified SMA copolymers and their compounds with epoxy resins were also characterized in terms of dielectric loss or dissipation factor (D), which have shown more noticeable relation with their stereo-structures as well.
近年来，由于包括第五代（5G）无线通信在内的高频无线通信环境的迅猛发展，需要更坚固的印刷电路板（PCB）应用基板，尤其是功耗更低的基板。在本研究中，制备了基于苯乙烯-马来酸酐（SMA）共聚物的改性树脂，并将其作为粘结剂树脂进行评估，以实现用于超高频（UHF；1GHz~9.4GHz）PCB应用的低介电常数或相对介电常数（ε：<3.0）基板。改性SMA共聚物的低ε介电特性可能与碳链的立体结构或构象取向的影响有关，其中通过X射线衍射（XRD）和核磁共振（NMR）光谱分析结晶度。低ε改性SMA共聚物及其与环氧树脂的化合物的预浸料薄膜也根据介电损耗或耗散因数（D）进行了表征，这也显示出与它们的立体结构有更明显的关系。
