Dalin Simona, Webster Sophie, Sugawara Neal, Zhang Shu, Wu Qiuqin, Cui Tracy, Liang Victoria, Beroukhim Rameen, Haber James E
Cancer Program, Broad Institute of MIT and Harvard, Cambridge, MA 02142, USA.
Departments of Cancer Biology and Medical Oncology, Dana-Farber Cancer Institute, Boston, MA 02215, USA.
bioRxiv. 2023 Oct 13:2023.10.09.561461. doi: 10.1101/2023.10.09.561461.
Double-strand break (DSB) repair is associated with a 1000-fold increase in mutations compared to normal replication of the same sequences. In budding yeast, repair of an HO endonuclease-induced DSB at the α locus can be repaired by using a homologous, heterochromatic donor harboring a transcriptionally silenced gene, resulting in a (Ura) repair product where is expressed. Repair-associated mutations can be selected by resistance to 5-fluoroorotic acid (FOA). Using this system, we find that a major class of mutations are -1 deletions, almost always in homonucleotide runs, but there are few +1 insertions. In contrast, +1 and -1 insertions in homonucleotide runs are nearly equal among spontaneous mutations. Approximately 10% of repair-associated mutations are interchromosomal template switches (ICTS), even though the sequence embedded in is only 72% identical with sequences on a different chromosome. ICTS events begin and end in regions of short microhomology, averaging 7 bp. Long microhomologies are favored, but some ICTS junctions are as short as 2 bp. Both repair-associated intragenic deletions (IDs) and tandem duplications (TDs) are recovered, with junctions sharing short stretches of, on average, 6 bp of microhomology. Intragenic deletions are more than 5 times more frequent than TDs. IDs have a mean length of 60 bp, but, surprisingly there are almost no deletions shorter than 25 bp. In contrast, TDs average only 12 bp. The usage of microhomologies among intragenic deletions is not strongly influenced by the degree of adjacent homeology. Together, these data provide a picture of the structure of the repair replication fork. We suggest that IDs and TDs occur within the migrating D-loop in which DNA polymerase δ copies the template, where the 3' end of a partly copied new DNA strand can dissociate and anneal with a single-stranded region of microhomology that lies either in front or behind the 3' end, within the open structure of a migrating D-loop. Our data suggest that ~100 bp ahead of the polymerase is "open," but that part of the repair replication apparatus remains bound in the 25 bp ahead of the newly copied DNA, preventing annealing. In contrast, the template region behind the polymerase appears to be rapidly reannealed, limiting template switching to a very short region.
与相同序列的正常复制相比,双链断裂(DSB)修复与突变增加1000倍有关。在芽殖酵母中,α位点处HO内切核酸酶诱导的DSB可通过使用携带转录沉默基因的同源异染色质供体进行修复,从而产生表达的(Ura)修复产物。与修复相关的突变可通过对5-氟乳清酸(FOA)的抗性来选择。利用该系统,我们发现一类主要的突变是-1缺失,几乎总是发生在同核苷酸序列中,但+1插入很少。相比之下,同核苷酸序列中的+1和-1插入在自发突变中几乎相等。尽管嵌入的序列与不同染色体上的序列只有72%的同一性,但约10%与修复相关的突变是染色体间模板转换(ICTS)。ICTS事件在短微同源性区域开始和结束,平均为7个碱基对。长微同源性更受青睐,但一些ICTS连接点短至2个碱基对。与修复相关的基因内缺失(ID)和串联重复(TD)均被检测到,连接点平均共享6个碱基对的短微同源性片段。基因内缺失的频率比TD高5倍以上。ID的平均长度为60个碱基对,但令人惊讶的是,几乎没有短于25个碱基对的缺失。相比之下,TD平均只有12个碱基对。基因内缺失中微同源性的使用不受相邻同源性程度的强烈影响。总之,这些数据描绘了修复复制叉的结构。我们认为,ID和TD发生在迁移的D环内,其中DNA聚合酶δ复制模板,部分复制的新DNA链的3'端可以解离并与位于3'端前方或后方的单链微同源性区域退火,该区域位于迁移的D环的开放结构内。我们的数据表明,聚合酶前方约100个碱基对是“开放的”,但修复复制装置的一部分仍结合在新复制DNA前方的25个碱基对中,阻止退火。相比之下,聚合酶后方的模板区域似乎迅速重新退火,将模板转换限制在非常短的区域。