Grajower R, Glick A, Gedalia I, Kochavi D
J Oral Rehabil. 1979 Jul;6(3):267-72. doi: 10.1111/j.1365-2842.1979.tb01504.x.
The tensile bond strength of Epoxylite 9075 and Enamelite to enamel treated with NaF and SnF2, at two concentrations, in the etching acid (H3PO4) was determined. The average fracture stress of those samples in which fracture occurred in the resin only, may be considered as the tensile strength of the resin, 69.8 +/- 5.6 kg/cm2. The mean fracture stresses of the Epoxy 9075 systems etched with pure phosphoric acid or with acid solutions containing 0.5% F salts were significantly higher than those treated with acid solutions containing 2% F salts. Incorporation of NaF or SnF2 in the etching solutions highly increased the fluoride concentration of enamel. The fluoride increase dependend on the fluoride concentration of the etching solution and was greater for NaF than SnF2.
测定了Epoxylite 9075和Enamelite与经两种浓度的NaF和SnF₂处理的牙釉质在蚀刻酸（H₃PO₄）中的拉伸粘结强度。那些仅在树脂中发生断裂的样品的平均断裂应力，可被视为树脂的拉伸强度，为69.8±5.6 kg/cm²。用纯磷酸或含0.5%氟盐的酸溶液蚀刻的Epoxy 9075体系的平均断裂应力，显著高于用含2%氟盐的酸溶液处理的体系。在蚀刻溶液中加入NaF或SnF₂会大幅提高牙釉质的氟浓度。氟浓度的增加取决于蚀刻溶液的氟浓度，且NaF的增加幅度大于SnF₂。
