银线键合技术综述

A Review of Silver Wire Bonding Techniques.

作者信息

An Bin, Zhou Hongliang, Cao Jun, Ming Pingmei, Persic John, Yao Jingguang, Chang Andong

机构信息

School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, China.

Henan International Joint Laboratory of Advanced Electronic Packaging Materials Precision Forming, Henan Polytechnic University, Jiaozuo 454003, China.

出版信息

Micromachines (Basel). 2023 Nov 20;14(11):2129. doi: 10.3390/mi14112129.

DOI:10.3390/mi14112129

PMID:38004986

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10673367/

Abstract

The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.

摘要

用银键合线替代金键合线可显著降低引线键合成本。本文全面概述了银线键合技术。首先，介绍了研究人员目前正在研究的各类银基键合线，包括纯银线、合金银线和涂覆银线，并描述了它们各自的特性和发展现状。其次，分析了银基键合线在制造和键合工艺方面的发展，包括常见的银线制造工艺及其对银线性能的影响，以及键合参数对银线键合质量和可靠性的影响。随后，讨论了银线键合的可靠性，重点分析了腐蚀、电迁移和金属间化合物对键合可靠性的影响，包括氯化和硫化的原因及形式、电迁移的机理和路径、金属间化合物的形成和演变，并评估它们对键合强度和可靠性的影响。最后，总结了银线键合技术的发展现状，并提出了银线未来的研究方向。