Zhou Hongliang, Chang Andong, Fan Junling, Cao Jun, An Bin, Xia Jie, Yao Jingguang, Cui Xiaobin, Zhang Yingchong
School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
School of Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454000, China.
Micromachines (Basel). 2023 Aug 16;14(8):1612. doi: 10.3390/mi14081612.
This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.
本文对铜（Cu）丝键合进行了全面综述。首先，介绍了市场上常见的铜丝类型，包括裸铜丝、涂层铜丝、绝缘铜丝和合金化铜丝。针对每种类型，讨论了它们的特性和应用领域。此外，我们深入探讨了自由空气球（FAB）形态对键合可靠性的影响，包括其对键合强度的影响和形成机制。接下来，分析了铜丝键合的可靠性，重点关注金属间化合物和腐蚀对键合可靠性的影响。具体而言，讨论了键合界面处金属间化合物的形成、生长和稳定性，并评估了它们对键合强度和可靠性的影响。还分析了腐蚀对铜丝键合的有害机制以及腐蚀抑制方法。随后，介绍了模拟在铜丝键合中的应用，包括有限元分析和分子动力学模拟，这些为更深入理解键合过程和失效机制提供了重要工具。最后，总结了铜丝键合的当前发展现状，并讨论了未来的研究方向。
