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钯镀铜键合线在微电子封装中的研究进展

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging.

作者信息

Zhang Yuemin, Guo Haiyun, Cao Jun, Wu Xuefeng, Jia Hewei, Chang Andong

机构信息

School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.

出版信息

Micromachines (Basel). 2023 Jul 31;14(8):1538. doi: 10.3390/mi14081538.

DOI:10.3390/mi14081538
PMID:37630074
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC10456959/
Abstract

Wire-bonding technology is the most commonly used chip interconnection technology in microelectronic packaging. Metal bonding wire is the key material for wire bonding and plays an important role in the reliability of electronic devices. In recent years, palladium-plated copper (PdCu) bonding wire has been widely used because of its low cost, good electrical and thermal conductivity, the fact that it is not easy to oxidize, and its high reliability. Therefore, it is necessary to review its research progress. In this paper, the preparation and application of palladium-plated copper bonding wire are reviewed. Firstly, the preparation methods of electroplating, electroless plating, and direct plating are introduced. Secondly, the factors affecting the distribution of Pd in free air balls and bonding interfaces, the effect of Pd on the formation and growth of intermetallic compounds in PdCu wire, stitch bond, and reliability of PdCu wire are summarized and analyzed in the application process. Finally, its development prospect is prospected. Hopefully, this review can help readers to have a comprehensive understanding of the preparation and application of palladium-plated copper bonding wires, and can accelerate the promotion of its application in more fields in the future.

摘要

引线键合技术是微电子封装中最常用的芯片互连技术。金属键合线是引线键合的关键材料，对电子器件的可靠性起着重要作用。近年来，镀钯铜线（PdCu）因其成本低、电导率和热导率良好、不易氧化以及可靠性高而被广泛应用。因此，有必要对其研究进展进行综述。本文对镀钯铜线的制备与应用进行了综述。首先，介绍了电镀、化学镀和直接镀的制备方法。其次，总结并分析了在应用过程中影响Pd在自由空气球和键合界面中分布的因素、Pd对PdCu线中金属间化合物形成和生长的影响、缝合键合以及PdCu线的可靠性。最后，对其发展前景进行了展望。希望这篇综述能够帮助读者全面了解镀钯铜线的制备与应用，并在未来加速其在更多领域的推广应用。

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本文引用的文献

1
Research Progress on Bonding Wire for Microelectronic Packaging.微电子封装用键合线的研究进展
Micromachines (Basel). 2023 Feb 11;14(2):432. doi: 10.3390/mi14020432.
2
Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.纳米级半导体封装中高温老化后金和钯涂层铜线的可靠性评估与活化能研究
J Electron Packag. 2013 Jun;135(2):0210101-210107. doi: 10.1115/1.4024013. Epub 2013 Apr 12.
3
Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging.
微电子封装中镀金、钯涂覆铜和钯掺杂铜丝的比较可靠性研究与分析。
PLoS One. 2013 Nov 7;8(11):e78705. doi: 10.1371/journal.pone.0078705. eCollection 2013.