Jia Jianyu, Li Zan, Hu Bo, Wang Yanqing, Wang Jing, Li Congbo, Xiang Wenfeng
Key Laboratory of Precision Machining of Shanxi Province, College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan 030024, China.
State Key Laboratory of Mechanical Transmission, College of Mechanical and Vehicle Engineering, Chongqing University, Chongqing 400044, China.
Micromachines (Basel). 2023 Nov 29;14(12):2178. doi: 10.3390/mi14122178.
Micro-tools comprising difficult-to-machine materials have seen widespread application in micro-manufacturing to satisfy the demands of micro-part processing and micro-device development. Taking micro-shafts as an example, the related developmental technology, based on wire electric discharge grinding (WEDG) as the core method, is one of the key technologies used to prepare high-precision micro-shafts. To enable efficient and high-precision machining of micro-shafts with target diameters, instead of performing multiple repeated on-machine measurements and reprocessing, a geometric constraint strategy is proposed based on the previously introduced twin-mirroring-wire tangential feed electrical discharge grinding (TMTF-WEDG). This strategy encompasses the tool setting method, tangential feed distance compensation, and an equation that establishes the relationship between tangential distance and diameter variation. These components are derived from a key points analysis of the geometric constraints. The micro-shafts with diameters of 50 µm and consistencies of ±1.5 µm are repeatedly processed. A series of micro-shafts with diameters ranging from 30 µm to 120 µm achieve geometric constraints with a diameter accuracy of ±2 µm, accompanied by the complete continuous automation of the entire process. Accordingly, it can be concluded that the geometric constraint strategy is flexible and stable and can be controlled with high precision in the TMTF-WEDG process.
由难加工材料制成的微工具在微制造中得到了广泛应用，以满足微零件加工和微器件开发的需求。以微轴为例，基于线电极放电磨削（WEDG）作为核心方法的相关开发技术是制备高精度微轴的关键技术之一。为了实现对具有目标直径的微轴进行高效、高精度加工，不再进行多次重复的在线测量和再加工，基于先前介绍的双镜像线切向进给放电磨削（TMTF-WEDG）提出了一种几何约束策略。该策略包括对刀方法、切向进给距离补偿以及建立切向距离与直径变化关系的方程。这些组成部分源自对几何约束的关键点分析。对直径为50 µm且公差为±1.5 µm的微轴进行了重复加工。一系列直径范围从30 µm到120 µm的微轴实现了直径精度为±2 µm的几何约束，同时整个过程完全连续自动化。因此，可以得出结论，几何约束策略灵活且稳定，在TMTF-WEDG过程中能够实现高精度控制。
