Department of Orthodontics & Dentofacial Orthopaedics, Manipal College of Dental Sciences, Manipal, Manipal Academy of Higher Education, Manipal, Karnataka, 576104, India.
Department of Public Health Dentistry, Manipal College of Dental Sciences, Manipal, Manipal Academy of Higher Education, Manipal, Karnataka, 576104, India.
F1000Res. 2023 Nov 7;12:1442. doi: 10.12688/f1000research.141328.1. eCollection 2023.
The dental profession is seeing a constant influx of new adhesive systems from manufacturers, each claiming to be more dependable than the last. This study assessed the bond strength and adhesive remnants of different light-cured adhesives used for bonding metal brackets to teeth.
80 extracted maxillary premolars with the sound crown structure were acid etched and bonded with brackets on their buccal surfaces utilizing primer and light-cured adhesives into four equal groups, which are Transbond XT, Heliosit, Enlight, and Bracepaste. Shear bond strength (SBS) for de-bonding the brackets were evaluated with Instron- testing machine after 48 hours. The de-bonded samples' adhesive remnant index (ARI) scores were also measured.
The maximum mean SBS was found for Transbond XT (12.91 ± 2.0 MPa), followed by Bracepaste (12.87 ± 1.59 MPa), Enlight (11.77 ± 1.87 MPa), and lowest for Heliosit (10.93 ± 1.71 MPa). According to the four point scale, adhesive remnant index (ARI), Transbond XT has the least adhesive residue left on the tooth, followed by Heliosit. Enlight and Bracepaste have a similar distribution of adhesive, with both having a maximum amount left.
It can be inferred that all groups involved demonstrated a satisfactory level of bond strength from a clinical perspective. Transbond XT is the preferred orthodontic adhesive over the other three adhesives due to its superior SBS and ARI properties.
牙科行业不断有新的制造商推出各种黏接系统，声称其产品比上一代更可靠。本研究评估了用于黏接金属托槽到牙齿的不同光固化黏接剂的黏接强度和黏接残余物。
80 颗上颌前磨牙具有完整的牙冠结构，用酸蚀剂进行酸蚀处理，并在颊面利用底漆和光固化黏接剂黏接托槽，将其分为四组，分别为 Transbond XT、Heliosit、Enlight 和 Bracepaste。48 小时后，使用 In stron 试验机评估用于脱除托槽的剪切黏接强度（SBS）。还测量了脱附样本的黏接残余指数（ARI）评分。
Transbond XT 的最大平均 SBS 最高（12.91 ± 2.0 MPa），其次是 Bracepaste（12.87 ± 1.59 MPa）、Enlight（11.77 ± 1.87 MPa），最低的是 Heliosit（10.93 ± 1.71 MPa）。根据四点量表，黏接残余指数（ARI），Transbond XT 留在牙齿上的黏接残余物最少，其次是 Heliosit。Enlight 和 Bracepaste 具有相似的黏接剂分布，两者都有最大的残留量。
可以推断，从临床角度来看，所有涉及的组都表现出了令人满意的黏接强度水平。Transbond XT 因其具有较高的 SBS 和 ARI 特性，是优于其他三种黏接剂的首选正畸黏接剂。
