Reymond O L
Basic Appl Histochem. 1986;30(4):487-94.
The diamond knife "semi" for ultramicrotomes was originally designed by its manufacturer (DIATOME S.A.), for cutting semi-thin sections from 0.2 micron to 2.0 micron. Cutting tests of Epon-embedded material (nervous system, myelin sheat) with this knife have shown that the quality of semi-thin sections is equivalent or better than that obtained with a glass knife, and much time could be saved during the microtomy of serial sections. The quality of thin sections (0.07 micron to 0.12 micron) is excellent and comparable to that obtained with a conventional diamond knife. Furthermore, when adjacent sections are cut thin and semi-thin (for immunochemistry or high voltage microscopy), both are excellent in that they are of uniform thickness. In conclusion, this tool has advantages for both light microscopy and transmission electron microscopy.
用于超薄切片机的“半”型钻石刀最初由其制造商(DIATOME S.A.)设计,用于切割厚度从0.2微米到2.0微米的半薄切片。用这把刀对环氧树脂包埋材料(神经系统、髓鞘)进行的切割测试表明,半薄切片的质量与用玻璃刀获得的相当或更好,并且在连续切片的切片过程中可以节省大量时间。薄切片(0.07微米到0.12微米)的质量非常好,与用传统钻石刀获得的相当。此外,当相邻切片切成薄切片和半薄切片(用于免疫化学或高压显微镜检查)时,两者都非常出色,因为它们厚度均匀。总之,该工具在光学显微镜和透射电子显微镜方面都具有优势。