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具有牺牲层的基于针尖的光刻技术。

Tip-based Lithography with a Sacrificial Layer.

作者信息

Jo Jeong-Sik, Lee Jinho, Choi Chiwon, Jang Jae-Won

机构信息

Division of Physics and Semiconductor Science, Dongguk University, Seoul, 04620, Republic of Korea.

出版信息

Small. 2024 May;20(19):e2309484. doi: 10.1002/smll.202309484. Epub 2024 Jan 29.

Abstract

The fabrication of a highly controlled gold (Au) nanohole (NH) array via tip-based lithography is improved by incorporating a sacrificial layer-a tip-crash buffer layer. This inclusion mitigates scratches during the nano-indentation process by employing a 300 nm thick poly(methyl methacrylate) layer as a sacrificial layer on top of the Au film. Such a precaution ensures minimal scratches on the Au film, facilitating the creation of sub-50 nm Au NHs with a 15 nm gap between the Au NHs. The precision of this method exceeds that of fabricating Au NHs without a sacrificial layer. Demonstrating its versatility, this Au NH array is utilized in two distinct applications: as a dry etching mask to form a molybdenum disulfide hole array and as a catalyst in metal-assisted chemical etching, resulting in conical-shaped silicon nanostructures. Additionally, a significant electric field is generated when Au nanoparticles (NPs) are placed within the Au NHs. This effect arises from coupling electromagnetic waves, concentrated by the Au NHs and amplified by the Au NPs. A notable result of this configuration is the enhancement factor of surface-enhanced Raman scattering, which is an order of magnitude greater than that observed with just Au NHs and Au NPs alone.

摘要

通过引入牺牲层(一种尖端碰撞缓冲层),基于尖端光刻技术制造高度可控的金(Au)纳米孔(NH)阵列的工艺得到了改进。这种方法通过在金膜顶部使用300纳米厚的聚甲基丙烯酸甲酯层作为牺牲层,减轻了纳米压痕过程中的划痕。这样的预防措施确保了金膜上的划痕最小,有助于制造出间距为15纳米、直径小于50纳米的金纳米孔。该方法的精度超过了无牺牲层制造金纳米孔的精度。这种金纳米孔阵列展示了其多功能性,被用于两种不同的应用:作为干法蚀刻掩膜以形成二硫化钼孔阵列,以及作为金属辅助化学蚀刻中的催化剂,从而得到锥形硅纳米结构。此外,当金纳米颗粒(NP)置于金纳米孔内时会产生显著的电场。这种效应源于耦合电磁波,该电磁波由金纳米孔集中并由金纳米颗粒放大。这种配置的一个显著结果是表面增强拉曼散射的增强因子,它比仅使用金纳米孔和金纳米颗粒时观察到的增强因子大一个数量级。

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