Zhang Kaihua, Ye Xiaojiang, Hou Zhijian, Ren Yahui, Shi Qiuyi
School of Mechanical and Electrical Engineering, Shenzhen Polytechnic University, Shenzhen, Guangdong, China.
School of Optical Information and Energy Engineering, Wuhan Institute of Technology, Wuhan, Hubei, China.
Sci Rep. 2024 Feb 28;14(1):4913. doi: 10.1038/s41598-024-52238-6.
The utilization of cold plate radiators as a prevalent method for indirect liquid cooling has been extensively investigated and implemented in server cooling systems. However, there is a lack of comprehensive study on the application of this technology at the chip size, indicating a need for more development and exploration in this area. A proposal was made for a grid-channel chip cold plate heat sink to facilitate the dissipation of heat from a chip. tests were conducted to investigate the impact of the flow rate of the cold plate and the layout of the inlet and outlet on various thermal parameters, including the average temperature, maximum temperature, thermal resistance, and uniformity coefficient of the cold plate. The tests were specifically conducted under a chip power of 150W, and the accuracy of the simulation was confirmed through the use of FLUENT. The findings indicate that the cold plate effectively regulates the temperature of the chip, ensuring it remains below 85 °C throughout all experimental groups. In contrast to the single in single out configuration, the single-in multiple-out layout exhibits a higher degree of temperature uniformity within the cold plate. Nevertheless, it is important to note that augmenting the quantity of exits does not guarantee an improvement in heat transfer efficiency. This outcome is contingent upon the presence of a longitudinal flow channel shared by the outlet and intake, as well as the dispersion characteristics of the outlet. Enhancing the dispersion of the exit can significantly enhance the thermal transfer efficiency of the cold plate. Furthermore, a strategy for adjusting the aperture of the orifice is proposed as a solution to address the challenges related to flow uniformity and the issue of high pressure drop in the cold plate.
冷板散热器作为间接液冷的一种常用方法，已在服务器冷却系统中得到广泛研究和应用。然而，对于该技术在芯片尺寸方面的应用缺乏全面研究，这表明在该领域需要更多的开发和探索。提出了一种用于芯片的网格通道冷板散热器，以促进芯片散热。进行了测试，以研究冷板流速以及进出口布局对各种热参数的影响，包括冷板的平均温度、最高温度、热阻和均匀系数。测试是在芯片功率为150W的条件下进行的，并通过使用FLUENT确认了模拟的准确性。研究结果表明，冷板有效地调节了芯片的温度，确保在所有实验组中芯片温度均保持在85°C以下。与单进单出配置相比，单进多出布局在冷板内表现出更高的温度均匀度。然而，需要注意的是，增加出口数量并不能保证提高传热效率。这一结果取决于出口和入口共享的纵向流道的存在以及出口的分散特性。增强出口的分散性可以显著提高冷板的热传递效率。此外，还提出了一种调节孔口孔径的策略，以解决与冷板内流动均匀性和高压降问题相关的挑战。
