Zhang Rong, Fang Xiang, Zhou Baokuan, Xiao Chuzeyuan, Xie Yutao, Fan Wuhou, Liu Qingting, Fu Xudong, Hu Shengfei, Wang Juan, Wong Ching Ping
Hubei Provincial Key Laboratory of Green Materials for Light Industry, New Materials and Manufacturing Talent Introduction and Innovation Demonstration Base, Hubei University of Technology, Wuhan 430068, Hubei, China.
Hubei Longzhong Laboratory, Xiangyang 441000, Hubei, China.
ACS Appl Mater Interfaces. 2024 Mar 27;16(12):15251-15261. doi: 10.1021/acsami.3c18502. Epub 2024 Mar 15.
Nowadays, the rapid development of electronic devices requires composites with high thermal conductivity and good electromagnetic shielding properties. The key challenge lies in the construction of high-performance conductive networks. Herein, an electrochemical expansion graphite foam (EEG) with a quasi-hyperbolic framework was prepared by an electrochemical expansion method, and then the epoxy resin (EP) was filled to fabricate the composites. The graphite plate was first electrochemically intercalated and then foamed, in which plasticization was caused by weak oxidation in intercalation and the quasi-hyperbolic framework was induced by foaming during expansion. These processes were characterized by Fourier transform infrared (FTIR), micro-Raman, X-ray photoelectron spectroscopy (XPS), and so on. Based on the highly efficient quasi-hyperbolic framework and high-quality graphite structure, the thermal conductivity of the composite reached 43.523 W/(m·K), and total electromagnetic interference (EMI) shielding (SE) reached 105 dB. The heat transfer behavior was simulated by finite element analysis (FEA) in detail. This method of preparing high thermal conductivity and electromagnetic shielding materials has a good application prospect.
如今,电子设备的快速发展需要具有高导热性和良好电磁屏蔽性能的复合材料。关键挑战在于构建高性能导电网络。在此,通过电化学膨胀法制备了具有准双曲线框架的电化学膨胀石墨泡沫(EEG),然后填充环氧树脂(EP)以制备复合材料。石墨板首先进行电化学插层然后发泡,其中插层过程中的弱氧化导致了增塑,膨胀过程中的发泡诱导了准双曲线框架。这些过程通过傅里叶变换红外光谱(FTIR)、显微拉曼光谱、X射线光电子能谱(XPS)等进行表征。基于高效的准双曲线框架和高质量的石墨结构,复合材料的热导率达到43.523W/(m·K),总电磁干扰(EMI)屏蔽效能(SE)达到105dB。通过有限元分析(FEA)详细模拟了热传递行为。这种制备高导热性和电磁屏蔽材料的方法具有良好的应用前景。