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机械合金化和粉末冶金制备的块状Ti-Cu合金的结构、电学和腐蚀性能

Structural, Electrical and Corrosion Properties of Bulk Ti-Cu Alloys Produced by Mechanical Alloying and Powder Metallurgy.

作者信息

Arkusz Katarzyna, Pasik Kamila, Nowak Marek, Jurczyk Mieczyslaw

机构信息

Department of Biomedical Engineering, Faculty of Mechanical Engineering, University of Zielona Gora, 9 Licealna Street, 65-417 Zielona Gora, Poland.

Institute of Materials Science and Engineering, Faculty of Materials Engineering and Technical Physics, Poznan University of Technology, 24 Jana Pawla II Street, 61-138 Poznan, Poland.

出版信息

Materials (Basel). 2024 Mar 23;17(7):1473. doi: 10.3390/ma17071473.

Abstract

Binary Ti-Cu (x = 1.6 and 3.0 wt.%) alloys were produced by the application of mechanical alloying and powder metallurgy processes. The influence of the copper concentration in titanium on the microstructure and properties of bulk alloys was investigated. The synthesized materials were characterized by an X-ray diffraction technique, scanning electron microscopy, and chemical composition determination. The electrochemical and corrosion properties were also investigated. Cold compaction and sintering reduced the content of α-Ti content in Ti98.4-Cu1.6 and Ti97-Cu3 alloys to 92.4% and 83.7%, respectively. Open Circuit Potential measurements showed a positive shift after the addition of copper, suggesting a potential deterioration in the corrosion resistance of the Ti-Cu alloys compared to pure Ti. Electrochemical Impedance Spectroscopy analysis revealed significant improvement in electrical conductivity after the addition of copper. Corrosion testing results demonstrated compromised corrosion resistance of Ti-Cu alloys compared to pure Ti. In summary, the comprehensive investigation of Ti-Cu alloys provides valuable insights for potential applications in biosensing.

摘要

通过机械合金化和粉末冶金工艺制备了二元Ti-Cu(x = 1.6和3.0 wt.%)合金。研究了钛中铜浓度对块状合金微观结构和性能的影响。采用X射线衍射技术、扫描电子显微镜和化学成分测定对合成材料进行了表征。还研究了其电化学和腐蚀性能。冷压和烧结使Ti98.4-Cu1.6和Ti97-Cu3合金中的α-Ti含量分别降至92.4%和83.7%。开路电位测量表明,添加铜后电位正向移动,这表明与纯钛相比,Ti-Cu合金的耐腐蚀性可能会降低。电化学阻抗谱分析表明,添加铜后电导率有显著提高。腐蚀测试结果表明,与纯钛相比,Ti-Cu合金的耐腐蚀性有所下降。总之,对Ti-Cu合金的综合研究为其在生物传感中的潜在应用提供了有价值的见解。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/5878/11012745/fa893deb8dc8/materials-17-01473-g001.jpg

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