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具有极高耐热性的金属有机框架粘合剂。

Metal-organic framework adhesives with exceptionally high heat resistance.

作者信息

Miyazaki Izuru, Masuoka Yumi, Suzumura Akitoshi, Moribe Shinya, Takao Hisaaki, Umehara Mitsutaro

机构信息

Frontier Research Office, Toyota Central R&D Labs., Inc., Nagakute, Japan.

出版信息

Sci Technol Adv Mater. 2024 Apr 29;25(1):2347193. doi: 10.1080/14686996.2024.2347193. eCollection 2024.

Abstract

We synthesized high-heat-resistant adhesives based on metal - organic frameworks owing to their high decomposition temperature and the absence of a glass transition. Heat-resistance tests were performed on adhesive joints consisting of zeolitic imidazolate framework (ZIF)-67-based adhesives and a copper substrate. The as-synthesized ZIF-67-based adhesive exhibited heat resistances at 600 and 700°C in air and nitrogen atmospheres, respectively, comparable to those of conventional high-heat-resistant polymer-based adhesives. The degradation mechanism of the ZIF-67 adhesives was investigated, and their high heat resistance was attributed to the stable existence of the ZIF-67 qtz phase in the adhesive layer at high temperatures without the formation of voids. Thus, adhesives based on ZIF-67 and other metal - organic frameworks can be applied in high-temperature industrial systems.

摘要

由于金属有机框架具有高分解温度且不存在玻璃化转变,我们基于其合成了高耐热性粘合剂。对由沸石咪唑酯框架(ZIF)-67基粘合剂和铜基板组成的粘合接头进行了耐热性测试。所合成的基于ZIF-67的粘合剂在空气和氮气气氛中分别在600和700°C下表现出耐热性,与传统的高耐热性聚合物基粘合剂相当。研究了ZIF-67粘合剂的降解机理,其高耐热性归因于ZIF-67 qtz相在高温下在粘合剂层中稳定存在且不形成空隙。因此,基于ZIF-67和其他金属有机框架的粘合剂可应用于高温工业系统。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ee6d/11149564/b0a45cb3e6b3/TSTA_A_2347193_UF0001_OC.jpg

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