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用于全纹理钙钛矿/硅串联太阳能电池的表面分子工程

Surface Molecular Engineering for Fully Textured Perovskite/Silicon Tandem Solar Cells.

作者信息

Chen Jun, Yang Shaofei, Jiang Long, Fan Ke, Liu Zhiliang, Liu Wentao, Li Wei, Huang Haitao, Zhang Hong, Yao Kai

机构信息

Institute of Photovoltaics, School of Physics and Materials Science, Nanchang University, Nanchang, 330031, China.

Suzhou Maxwell Technologies Co., Ltd., Suzhou, 215200, China.

出版信息

Angew Chem Int Ed Engl. 2024 Sep 2;63(36):e202407151. doi: 10.1002/anie.202407151. Epub 2024 Jul 31.

Abstract

Developing large-scale monolithic perovskite/silicon tandem devices based on industrial Czochralski silicon wafers will likely have to adopt double-side textured architecture, given their optical benefits and low manufacturing costs. However, the surface engineering strategies that are widely used in solution-processed perovskites to regulate the interface properties are not directly applicable to micrometric textures. Here, we devise a surface passivation strategy by dynamic spray coating (DSC) fluorinated thiophenethylammonium ligands, combining the advantages of providing conformal coverage and suppressing phase conversion on textured surfaces. From the viewpoint of molecular engineering, theoretical calculation and experimental results demonstrate that introducing trifluoromethyl group provide more effective surface passivation through strong interaction and energy alignment by forming a dipole layer. Consequently, the DSC treatment of this bifunctional molecule enables the tandem cells based on industrial silicon wafers to achieve a certified stabilized power conversion efficiency of 30.89 %. In addition, encapsulated devices display excellent operational stability by retaining over 97 % of their initial performance after 600 h continuous illumination.

摘要

鉴于基于工业直拉硅晶圆开发大规模单片钙钛矿/硅串联器件具有光学优势且制造成本低,可能不得不采用双面纹理结构。然而,溶液处理钙钛矿中广泛用于调节界面性质的表面工程策略并不直接适用于微米级纹理。在此,我们通过动态喷涂(DSC)氟化苯乙铵配体设计了一种表面钝化策略,结合了在纹理表面提供保形覆盖和抑制相变的优点。从分子工程的角度来看,理论计算和实验结果表明,引入三氟甲基通过形成偶极层的强相互作用和能量排列提供了更有效的表面钝化。因此,这种双功能分子的DSC处理使基于工业硅晶圆的串联电池实现了30.89%的认证稳定功率转换效率。此外,封装器件在连续光照600小时后仍保持其初始性能的97%以上,显示出优异的运行稳定性。

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