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用于光学加密和柔性集成电路载体板的设计皱纹。

Designed wrinkles for optical encryption and flexible integrated circuit carrier board.

作者信息

Zhong Shilong, Zhu Zhaoxiang, Huo Qizheng, Long Yubo, Gong Li, Ma Zetong, Yu Dingshan, Zhang Yi, Liang Weien, Liu Wei, Wang Cheng, Yuan Zhongke, Yang Yuzhao, Lu Shaolin, Chen Yujie, Zheng Zhikun, Chen Xudong

机构信息

School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou, China.

Jieyang Branch of Chemistry and Chemical Engineering Guangdong Laboratory, Jieyang, Guangdong, China.

出版信息

Nat Commun. 2024 Jul 4;15(1):5616. doi: 10.1038/s41467-024-50069-7.

DOI:10.1038/s41467-024-50069-7
PMID:38965253
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC11224375/
Abstract

Patterns on polymers usually have different mechanical properties as those of the substrates, causing deformation or distortion and even detachment of the patterns from the polymer substrates. Herein, we present a wrinkling strategy, which utilizes photolithography to define the area of stress distribution by light-induced physical crosslinking of polymers and controls diffusion of residual solvent to redistribute the stress and then offers the same material for patterns as substrate by thermal polymerization, providing uniform wrinkles without worrying about force relaxation. The strategy allows the recording and hiding of up to eight switchable images in one place that can be read by the naked eye without crosstalk, applying the wrinkled polymer for optical anti-counterfeiting. The wrinkled polyimide film was also utilized to act as a substrate for the creation of fine copper circuit by a full-additive process. It generates flexible integrated circuit (IC) carrier board with copper wire density of 400% higher than that of the state-of-the-art in industry while fulfilling the standards for industrialization.

摘要

聚合物上的图案通常具有与基底不同的机械性能,这会导致图案变形、扭曲,甚至从聚合物基底上脱落。在此,我们提出一种起皱策略,该策略利用光刻技术通过聚合物的光致物理交联来定义应力分布区域,并控制残余溶剂的扩散以重新分布应力,然后通过热聚合为图案和基底提供相同的材料,从而产生均匀的皱纹,而无需担心力的松弛。该策略允许在一个位置记录和隐藏多达八个可切换图像,这些图像无需串扰即可用肉眼读取,将起皱聚合物应用于光学防伪。起皱的聚酰亚胺薄膜还被用作通过全加成工艺制造精细铜电路的基底。它生成了柔性集成电路(IC)载板,其铜线密度比行业内最先进的产品高出400%,同时满足工业化标准。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/75979ca55f43/41467_2024_50069_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/f086f249c4fb/41467_2024_50069_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/2aa888d4276b/41467_2024_50069_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/2170b3d46d68/41467_2024_50069_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/75979ca55f43/41467_2024_50069_Fig4_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/f086f249c4fb/41467_2024_50069_Fig1_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/2aa888d4276b/41467_2024_50069_Fig2_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/2170b3d46d68/41467_2024_50069_Fig3_HTML.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d02/11224375/75979ca55f43/41467_2024_50069_Fig4_HTML.jpg

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